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Intel

Pentium

III Processor in the FC-PGA2 Package Thermal Design Guidelines

249660-001

Table 3-1. FC-PGA2 Processor Package Dimensions

Symbol Millimeters

Inches

Minimum

Maximum

Notes

Minimum

Maximum

Notes

2.266

2.690

0.089

0.106

0.980

1.180

0.038

0.047

30.800

31.200

1.212

1.229

30.800

31.200

1.212

1.229

33.000 max

1.299 max

33.000 max

1.299 max

49.428

49.632

1.946

1.954

45.466

45.974

1.790

1.810

0.000

17.780

0.000

0.700

0.000

17.780

0.000

0.700

0.000

0.889

0.000

0.035

H 2.540

Nominal

0.100

Nominal

3.048

3.302

0.120

0.130

0.431

0.483

0.017

0.019

Pin TP

0.508 Diametric True Position (Pin-to-Pin)

0.020 Diametric True Position (Pin-to-Pin)

NOTES:

1. Capacitors will be placed on the pin-side of the FC-PGA2 package in the area defined by G1, G2, and G3. This

area is a keep-out zone for motherboard designers.

2. In case of conflict, the processor datasheets supercede this document.

Содержание FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz

Страница 1: ...Intel Pentium III Processor in the FC PGA2 Package Thermal Design Guidelines June 2001 Order Number 249660 001 R...

Страница 2: ...aining applications Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructio...

Страница 3: ...ns 17 5 6 1 Placement 18 5 6 2 Fan Direction 18 5 6 3 Size and Quantity 18 5 6 4 Venting 18 5 6 4 1 Placement 18 5 6 4 2 Area and Size 18 5 6 4 3 Vent Shape 19 6 Alternative Cooling Solutions 21 6 1 D...

Страница 4: ...k 25 Figure 7 3 Local ambient Thermocouple Measurement Locations Active Heatsink 26 Figure 7 4 Locating Geometric Center of Processor 28 Figure 7 5 Thermocouple Preparation 28 Figure 7 6 Thermocouple...

Страница 5: ...Intel Pentium III Processor in the FC PGA2 Package Thermal Design Guidelines R 249660 001 5 Revision History Rev Description Date 001 Initial Release June 2001...

Страница 6: ...Intel Pentium III Processor in the FC PGA2 Package Thermal Design Guidelines R 6 249660 001 This page is intentionally left blank...

Страница 7: ...PGA2 package with an integrated heat spreader which is primarily intended for the desktop and server segments The physical dimensions and power numbers used in this document are for reference only Pl...

Страница 8: ...t from the case to the heatsink TIM the thermal resistance of the thermal interface material Also referred to as CS case to sink thermal resistance CA the thermal resistance between the processor s ca...

Страница 9: ...within functional limits The functional temperature limit is the range within which the electrical circuits can be expected to meet their specified performance requirements Operation outside the func...

Страница 10: ...Intel Pentium III Processor in the FC PGA2 Package Thermal Design Guidelines R 10 249660 001 This page is intentionally left blank...

Страница 11: ...hermal performance and is the interface for attaching a heatsink The processor core is mounted with the back of the die facing up hence the term flip chip The pin grid array on the backside of the int...

Страница 12: ...x 1 299 max D 49 428 49 632 1 946 1 954 D1 45 466 45 974 1 790 1 810 G1 0 000 17 780 0 000 0 700 G2 0 000 17 780 0 000 0 700 G3 0 000 0 889 0 000 0 035 H 2 540 Nominal 0 100 Nominal L 3 048 3 302 0 12...

Страница 13: ...limit the size number and types of fans that can be used in a particular design To develop a reliable cost effective thermal solution all of the above variables must be considered Thermal characteriza...

Страница 14: ...Intel Pentium III Processor in the FC PGA2 Package Thermal Design Guidelines R 14 249660 001 This page is intentionally left blank...

Страница 15: ...r air through the system fan Care must be taken to minimize the heating effects of other system components and to eliminate warm air re circulation If no air path exists across the processor heatsink...

Страница 16: ...surface area of the heatsink itself Although there have been many advancements in fin density and geometries that allow for a better performing heatsink an active or more advanced thermal solution may...

Страница 17: ...ling characteristics of the material Thermal resistance is a description of the ability of the thermal interface material to transfer heat from one surface to another The higher the thermal resistance...

Страница 18: ...e the need for a second fan a larger fan or a higher speed fan For an actively cooled heatsink the system airflow direction may not be as critical for proper thermal performance but it will be importa...

Страница 19: ...60 001 19 EMI containment area due to EMI constraints Outside the EMI containment area the open percentage can be greater if needed for aesthetic appeal i e bezel cosmetics 5 6 4 3 Vent Shape Round st...

Страница 20: ...Intel Pentium III Processor in the FC PGA2 Package Thermal Design Guidelines R 20 249660 001 This page is intentionally left blank...

Страница 21: ...ing is to be used it should direct the airflow evenly from the fan through the length of the heatsink This should be accomplished if possible with smooth gradual turns as this will reduce air impedanc...

Страница 22: ...Intel Pentium III Processor in the FC PGA2 Package Thermal Design Guidelines R 22 249660 001 This page is intentionally left blank...

Страница 23: ...resistance of the case to local ambient CA is comprised of the case to sink thermal resistance CS and the sink to local ambient thermal resistance SA see Figure 7 1 The CS value is strongly dependent...

Страница 24: ...ound the processor TLA The lower the thermal resistance between the processor and the local ambient air the more efficient the thermal solution is The required CA is dependent upon the maximum allowed...

Страница 25: ...ized air temperature around the processor during system thermal testing These guidelines are meant as a reasonable expectation to ensure the product specifications are met 7 3 1 Local ambient Temperat...

Страница 26: ...other system components The thermocouples should be centered relative to the fan and heatsink see top view in Figure 7 3 TLA should be the average of the thermocouple measurements during system therma...

Страница 27: ...poor thermal contact between the thermocouple junction and the surface of the integrated heat spreader heat loss by radiation convection by conduction through thermocouple leads or by contact between...

Страница 28: ...layer of thermocouple insulation sometimes clear is not covering the bead 5 Create a slight downward bend in the wires about a 1 16 from the bead Once the thermocouple is in place this will ensure th...

Страница 29: ...epoxy at room temperature for at least 12 hours Some epoxy may have different cure times Refer to the manufacturer s instructions 11 Once the epoxy has cured remove all tape and check for any residual...

Страница 30: ...n on a typical heatsink base Figure 7 8 shows the groove dimensions required to route a thermocouple to the center of the heatsink without interfering the IHS to heatsink attachment The depth for the...

Страница 31: ...cessor to very near the TDP identified in the processor datasheets and is intended to be a tool for the analysis and validation of system cooling solutions All systems should be designed with the abil...

Страница 32: ...and HIPWRMP2 EXE utilities have an on screen message with version number information and usage help To halt execution of the application use the Windows NT Task Manager or Windows 95 98 Task Bar to st...

Страница 33: ...balance size and space constraints with acoustic noise This document has presented the conditions and requirements for properly designing a heatsink solution for an FC PGA2 packaged processor based s...

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