Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz, Руководство по дизайну

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Intel
®
Pentium
®
III Processor in the FC-PGA2 Package Thermal Design Guidelines
R
249660-001 7
1. Introduction
In a system environment, the processor's temperature is a function of both the system and component
thermal characteristics. The system level thermal constraints consist of the local-ambient temperature at
the processor and the airflow over the processor, as well as the physical constraints at and above the
processor. The processor’s temperature depends on the component power dissipation, size and material
(effective thermal conductivity) of the integrated heat spreader, and the presence of a thermal cooling
solution.
All of these parameters are aggravated by the continued push of technology to increase performance
levels (higher operating speeds, GHz) and packaging size and density (more transistors). As operating
frequencies increase and packaging size decreases, the power density increases and the thermal cooling
solution space and airflow become more constrained. The result is an increased importance on system
design to ensure that thermal design requirements are met for each component in the system.
1.1. Document Scope
This document discusses thermal management techniques for Intel
®
Pentium
®
III processors in the FC-
PGA2 package with an integrated heat spreader, which is primarily intended for the desktop and server
segments. The physical dimensions and power numbers used in this document are for reference only.
Please refer to the respective datasheets for the product dimensions, thermal power dissipation, and
maximum case temperature. In case of conflict, the specifications in the processor datasheets supercede
any data in this document.
1.2. References
Document Title Order Number
Pentium
®
III Processor for the PGA370 Socket Datasheet 245264
Intel
®
Pentium
®
III Processor with 512Kb L2 Cache Datasheet 249657
370-Pin Socket (PGA370) Design Guidelines 244410
AP-905 Pentium
®
III Processor Thermal Design Guidelines 245087
FC-PGA2 Package Thermal / Mechanical Solution Functional Specifications Contact your Intel Field
Sales Representative
Performance ATX Desktop System Thermal Design Suggestions v1.0 http://www.formfactors.org
ATX Thermal Design Suggestions v1.0 http://www.formfactors.org
Performance MicroATX Desktop System Thermal Design Suggestions v1.0 http://www.formfactors.org
MicroATX Thermal Design Suggestions v1.0 http://www.formfactors.org
FlexATX Thermal Design Suggestions v1.0 http://www.formfactors.org
Evaluation Board for Microprocessor System Temperature Monitor or EVAL-
ADM1021 http://www.analog.com
Analog Devices EVAL-ADM1021 kit datasheet http://www.analog.com
Maxim Integrated Products MAX1617EV Kit datasheet http://www.maxim-ic.com