Datasheet, Volume 1
5
Power and Ground Lands ........................................................... 51
Decoupling Guidelines ............................................................... 52
Voltage Identification (VID)........................................................ 52
Reserved or Unused Signals..................................................................... 56
Storage Conditions Specifications ............................................................. 60
Voltage and Current Specifications............................................................ 61
CC
Overshoot Specifications ...................................................... 63
Signal DC Specifications .......................................................................... 64
7.5.3.1
PCI Express* DC Specifications................................................... 69
DMI2 / PCI Express* DC Specifications ........................................ 69
Reset and Miscellaneous Signal DC Specifications .......................... 69
............................................................................................. 71
Package Mechanical Specifications
........................................................................ 119
Figures
PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2) .................. 12
Idle Power Management Breakdown of the Processor Cores..................................... 31
CC
Overshoot Example Waveform ...................................................................... 63
Tables
Coordination of Core Power States at the Package Level ......................................... 35
Memory Channel DDR0, DDR1, DDR2, DDR3......................................................... 41
Содержание BX80619I73960X
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