Datasheet, Volume 1
15
Introduction
Intel
®
Virtualization
Technology (Intel
®
VT)
Processor virtualization which when used in conjunction with Virtual Machine Monitor
software enables multiple, robust independent software environments inside a single
platform.
Intel
®
VT-d
Intel
®
Virtualization Technology (Intel
®
VT) for Directed I/O. Intel VT-d is a hardware
assist, under system software (Virtual Machine Manager or OS) control, for enabling I/O
device virtualization. Intel VT-d also brings robust security by providing protection from
errant DMAs by using DMA remapping, a key feature of Intel VT-d.
Integrated Heat
Spreader (IHS)
A component of the processor package used to enhance the thermal performance of the
package. Component thermal solutions interface with the processor at the IHS surface.
Jitter
Any timing variation of a transition edge or edges from the defined Unit Interval (UI).
IOV
I/O Virtualization
LGA2011 Socket
The 2011-land FC-LGA package mates with the system board through this surface mount,
2011-contact socket.
LLC
Last Level Cache
ME
Management Engine
NCTF
Non-Critical to Function: NCTF locations are typically redundant ground or non-critical
reserved, so the loss of the solder joint continuity at end of life conditions will not affect
the overall product functionality.
Intel
®
Core™ i7
processor family for the
LGA-2011 socket
Intel’s 32-nm processor design, follow-on to the 32-nm 2nd Generation Intel
®
Core™
processor family desktop design.
PCH
Platform Controller Hub. The next generation chipset with centralized platform capabilities
including the main I/O interfaces along with display connectivity, audio features, power
management, manageability, security and storage features.
PCU
Power Control Unit.
PCIe*
PCI Express*
PECI
Platform Environment Control Interface
Processor
The 64-bit, single-core or multi-core component (package)
Processor Core
The term “processor core” refers to Si die itself which can contain multiple execution
cores. Each execution core has an instruction cache, data cache, and 256-KB L2 cache. All
execution cores share the L3 cache. All DC and AC timing and signal integrity
specifications are measured at the processor die (pads), unless otherwise noted.
PCU
Uncore Power Manager
Rank
A unit of DRAM corresponding four to eight devices in parallel, ignoring ECC. These
devices are usually, but not always, mounted on a single side of a DDR3 DIMM.
SCI
System Control Interrupt. Used in ACPI protocol.
SSE
Intel
®
Streaming SIMD Extensions (Intel
®
SSE)
SKU
A processor Stock Keeping Unit (SKU) to be installed in the platform. Electrical, power and
thermal specifications for these SKU’s are based on specific use condition assumptions.
SMBus
System Management Bus. A two-wire interface through which simple system and power
management related devices can communicate with the rest of the system. It is based on
the principals of the operation of the I2C* two-wire serial bus from Philips Semiconductor.
Storage Conditions
A non-operational state. The processor may be installed in a platform, in a tray, or loose.
Processors may be sealed in packaging or exposed to free air. Under these conditions,
processor landings should not be connected to any supply voltages, have any I/Os biased
or receive any clocks. Upon exposure to “free air” (that is, unsealed packaging or a device
removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
TAC
Thermal Averaging Constant
TDP
Thermal Design Power
TSOD
Thermal Sensor on DIMM
UDIMM
Unbuffered Dual In-line Module
Table 1-1.
Terminology (Sheet 2 of 3)
Term
Description
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