Development Board Features
Development Kit User’s Manual
29
Component
Fern Hill Board Implementation
Comments
Extended Debug Port (XDP)
XDP connector (for processor run control) RJ-
11 for Intel® Management Engine JTAG
LAI support
IAMT® support
Intel® Active Management Technology
(Intel® AMT) is supported on the CRBs
with M0 M1, and M-off management
states
Controller Link to GMCH and to wireless LAN
Intel® Management Engine power plane
Intel® Turbo
Memory
Intel® Turbo Memory (formerly Robson
technology) of hardware cache is
supported using Intel Turbo Memory
add-in card
Power
Management
ACPI Compliant
C0, C1, C1E, C2, C2E, C3, C3E, C4E, slow C4
exit, Intel® Enhanced Deeper Sleep (with
Level5 read) and Intel Deep Power Down
Technology processor power states for
mobility processors
S0 (Power On), S3 (Suspend to RAM), S4
(Suspend to Disk), S5 (Soft Off) system
power states.
M0 (All Wells powered), M1 (Main Well down,
Only Intel® Management Engine power on),
M-off (Intel Management Engine powered off)
manageability power states
Form Factor
ATX 2.2 like form factor
10 layer board(8 layer with 2 additional
validation hooks layer) – 12” x 10.2”
Miscellaneous
EBL support
Intel® Display Power Saving Technology
(Intel® DPST) 4.0 support
SPWG 3.5 complaint LVDS panel support
Mobile Digital Office initiatives
TPM 1.2 and support for Trusted Platform
Enabling
Intel® Active Management Technology
(Intel® AMT) support
Lead free design
EBL support includes:
•
PSI2 support
•
Backlight optimization
•
Device Power State (DPS)
•
DVD power control
•
Ambient Light Sensor
•
Narrow VDC
•
Ambient Light Sense with UPD through IR
sensor
•
Intel DPST 4.0
•
72 WHr Battery
•
LED Backlight
•
Intel® Adaptive Mobile Power System
(Intel® AMPS)
•
Dynamic Display Power Optimization
Note:
Review the document provided with the Development Kit titled “Important Safety and
Regulatory Information”. This document contains safety warnings and cautions that
must be observed when using this development kit.
