About This Manual
Development Kit User’s Manual
11
Term/Acronym Definition
Media Expansion
Card
The Media Expansion Card (MEC) provides digital display options through
the SDVO interface. The MEC card also incorporates video-in via a x1 PCI
Express* port.
Pad
The electrical contact point of a semiconductor die to the package
substrate. A pad is only observable in simulations.
Pillar Rock
The name of the development board that uses Intel
®
Core™ 2 Duo
processor with the Mobile Intel
GM45
Express Chipset and
DDR2
SDRAM
Pin
The contact point of a component package to the traces on a substrate,
such as the motherboard. Signal quality and timings may be measured at
the pin.
Silver Cascade
The name of the development board that uses Intel
®
Core™ 2 Duo
processor with the Mobile Intel
GM45
Express Chipset and
DDR3
SDRAM
System Bus
The System Bus is the microprocessor bus of the processor.
System
Management Bus
A two-wire interface through which various system components may
communicate.
VCC (CPU core)
VCC (CPU core) is the core power for the processor. The system bus is
terminated to VCC (CPU core).
Table 3
defines the acronyms used throughout this document.
Table 3. Acronyms
Acronym Definition
AC Alternating
Current
ACPI
Advanced Configuration and Power Interface
ADD2
Advanced Digital Display 2
ADD2N
Advanced Digital Display 2 Normal
AGTL or AGTL+
Assisted Gunning Transceiver Logic (See also Table 2 above)
AMI
American Megatrends Inc. (BIOS developer)
AMPS or iAMPS
(Intel) Adaptive Mobile Power System
AMT or iAMT
(Intel) Active Management Technology
ATA
Advanced Technology Attachment (disk drive interface)
ATX
Advance Technology Extended (motherboard form factor)
BGA
Ball Grid Array
BIOS
Basic Input/Output System
BSEL
Bus Select (Front Side Bus frequency control signals)
CL Controller
Link
CMOS Complementary
Metal-Oxide-Semiconductor
COM Communications
CPU
Central Processing Unit (processor)
