Thermal Specifications and Design Considerations
76
Datasheet
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
. In all cases the Thermal Monitor or
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
NOTES:
1.
Specification is at 36 °C T
C
and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
2.
Specification is at 34 °C T
C
and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
4.
This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum T
C
will vary depending on the TDP of the
individual processor. Refer to thermal profile figure and associated table for the allowed
combinations of power and T
C
.
5.
775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal
requirements.
Table 25.
Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power
(W)
3,4
Extended
HALT
Power
(W)
1
Deeper
Sleep
Power
(W)
2
775_VR_
CONFIG_06
Guidance
5
Minimum
T
C
(°C)
Maximum
T
C
(°C)
Notes
E5200
E5300
2.50
2.66
65.0
65.0
8
8
6
4
775_VR_CONFIG
_06
(65 W)
5
5
See
and
Содержание BX80571E5300 - Pentium 2.6 GHz Processor
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