Intel
®
945G Express Chipset GMCH Thermal Design Guide
Product Specifications
2.3
Package Loading Specifications
Table 1 provides static load specifications for the chipset package. This mechanical maximum
load limit should not be exceeded during heat sink assembly, shipping conditions, or standard use
condition. Also, any mechanical system or component testing should not exceed the maximum
limit. The chipset package substrate should not be used as a mechanical reference or load-bearing
surface for the thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solution.
Table 1 Chipset Loading Specifications
Parameter Maximum
Notes
Static
15 lbf
1, 2, 3
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the chipset package
2. This is the maximum force that can be applied by a heat sink retention clip. The clip must also provide the
minimum specified load on the chipset package.
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package only.
2.4 Thermal
Specifications
To ensure proper operation and reliability of the 945G Express Chipset GMCH, the temperature
must be at or below the maximum value specified in Table 2. System and component level
thermal enhancements are required to dissipate the heat generated and maintain the GMCH within
specifications. Section 3 provides the thermal metrology guidelines for case temperature
measurements.
The GMCH should also operate above the minimum case temperature specification listed in the
table below.
Table 2 GMCH Case Temperature Specifications
Parameter Value
T
C-MAX
99.0°
C
T
C-MIN
0°
C
NOTE:
Thermal specifications assume an attached heat sink is present.
2.5
Thermal Design Power (TDP)
Thermal design power (TDP) is the estimated power dissipation of the GMCH based on normal
operating conditions including V
CC
and T
C-MAX
while executing real worst-case power intensive
applications. This value is based on expected worst-case data traffic patterns and usage of the
chipset and does not represent a specific software application. TDP attempts to account for
expected increases in power due to variation in chipset current consumption due to silicon process
variation, processor speed, DRAM capacitive bus loading and temperature. However, since these
variations are subject to change, the TDP cannot guarantee that all applications will not exceed the
TDP value.
The system designer must design a thermal solution for the GMCH such that it maintains T
C
below T
C-MAX
for a sustained power level equal to TDP. Please note that the T
C-MAX
specification
Order #308643
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