Intel
®
945G Express Chipset GMCH Thermal Design Guide
Thermal Metrology
Figure 3
0° Angle Attach Heat Sink Modifications (Generic Heat Sink Side and Bottom View)
NOTE:
Drawing not to scale.
3.2 Airflow
Characterization
Figure 4 describes the recommended location for air temperature measurements measured relative
to the component. For a more accurate measurement of the average approach air temperature,
Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm
(1.0 in.) apart. Locations for both single and paired thermocouples are presented.
Figure 4
Airflow Temperature Measurement Locations
Airflow velocity should be measured using industry standard air velocity sensors. Typical airflow
sensor technology may include hot wire anemometers. Figure 4 provides guidance for airflow
velocity measurement locations. These locations are for a typical JEDEC test setup and may not
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