Intel
®
945G Express Chipset GMCH Thermal Design Guide
Reference Thermal Solution
Figure 9
GMCH Retention Mechanism Component Keep-out Zone
0.896
0.345
0.120
1.156
0.170
(0.165)
0.100
0.225
2x 0.060
(0.345)
See Detail A
0.070" Component
Keepout
0.100" Component
Keepout
0.165
0.100
0.200
0.173
0.345
0.083
2x 0.038
Plated Through Hole
Component Keepout
Detail A
2x 0.056
Trace Keepout
4.5 Environmental
Reliability
Requirements
The environmental reliability requirements for the reference thermal solution are shown in Table
5. These should be considered as general guidelines. Validation test plans should be defined by
the user based on anticipated use conditions and resulting reliability requirements.
Table 5 Reference Thermal Solution Environmental Reliability Requirements
Test
1
Requirement
Pass/Fail
Criteria
2
Mechanical Shock
•
•
•
3 drops for + and - directions in each of 3 perpendicular axes
(i.e., total 18 drops).
Profile: 50 G trapezoidal waveform, 11 ms duration, 4.3 m/s
(170 in/s) minimum velocity change.
Setup: Mount sample board on test fixture. Include 550 g
processor heat sink.
Visual\electrical check
Cross section should have
crack length <50%
Random Vibration
•
•
•
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual/electrical check
Cross section should have
crack length <50%
Thermal Cycling
•
-40
°
C to +85
°
C, 900 cycles
Thermal performance
Unbiased Humidity
•
85% relative humidity / 55
°
C, 1000 hours
Visual check
NOTE:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
18
Order #308643
