Intel
®
945G Express Chipset GMCH Thermal Design Guide
Reference Thermal Solution
4.2
Mechanical Design Envelope
The motherboard component keep-out restrictions for the GMCH on a 1U platform are included
in Section 4.4, Figure 8 and Figure 9.
This heat sink extends 32.32 mm (1.272 in.) nominally above the board when mounted. System
integrators should ensure no board or chassis components would intrude into the volume occupied
by the GMCH thermal solution.
4.3
Thermal Solution Assembly
The reference thermal solution for the GMCH for the 1U server platform is shown in Figure 7 and
Appendix B and is a copper heat sink attached to the motherboard with a wire clip and two
motherboard anchors. The heat sink is attached to the motherboard by assembling the anchors into
the board, placing the heat sink over the GMCH and then fastening the clip to the anchors. A
thermal interface material (Honeywell* PCM45F) is pre-applied to the heat sink bottom over an
area which contacts the package die.
For information on the reference solution for the ATX and BTX form factors refer to the
Intel
®
945G/945P Express Chipset Family Thermal and Mechanical Design Guidelines
.
Figure 7
1U GMCH Heat Sink
4.3.1 Solder-Down
Anchors
For platforms that have very limited board space, a clip retention solder-down anchor has been
developed to minimize the impact of clip retention on the board. It is based on a standard three-
pin jumper and is soldered to the board like any common through-hole header. A new anchor
design is available with 45° bent leads to increase the anchor attach reliability over time. The part
number and vendor information are contained in Appendix A.
16
Order #308643
