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Intel

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20

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945G Express Chipset GMCH Thermal Design Guide

echanical Drawings

Order #308643

Appendix B Mechanical Drawings

This appendix contains the following mechanical drawings:

Drawing Name

Page Number

Package Drawing

Reference Thermal Solution Assembly

1U Copper Heat Sink

Heat Sink Gasket

Torsional Heat Sink Attach Clip

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Содержание 945G - Bulk Single Unit Atx Exp

Страница 1: ...Intel 945G Express Chipset Graphics and Memory Controller Hub GMCH for Embedded Applications Thermal Design Guide August 2005 Order 308643 001...

Страница 2: ...including Intel Corporation This document and the software described in it are furnished under license and may only be used or copied in accordance with the terms of the license The information in th...

Страница 3: ...Solution 14 4 1 Operating Environment 14 4 1 1 1U Form Factor Operating Environment 14 4 2 Mechanical Design Envelope 16 4 3 Thermal Solution Assembly 16 4 3 1 Solder Down Anchors 16 4 3 2 Thermal In...

Страница 4: ...0 Package Drawing 21 11 Reference Thermal Solution Assembly 22 12 1U Copper Heat Sink 23 13 Heat Sink Gasket 24 14 Torsional Heat Sink Attach Clip 25 Tables 15 1 Chipset Loading Specifications 9 2 GMC...

Страница 5: ...design a cooling solution for systems that implement the 945G Express Chipset GMCH Properly designed solutions provide adequate cooling to maintain the 945G Express Chipset GMCH case temperature at or...

Страница 6: ...d heat sink This temperature is measured at the geometric center of the top of the package case die TDP Thermal design power is specified as the highest sustainable power level of most or all of the r...

Страница 7: ...41 530 531 and 520 521 Supporting Hyper Threading Technology Datasheet Available electronically see Note Intel Pentium 4 Processor on 90 nm Process in the 775 Land LGA Package Thermal and Mechanical D...

Страница 8: ...drawing of the package is shown in Figure 10 Appendix B 2 2 Non Grid Array Package Ball Placement The 945G Express Chipset GMCH package utilizes a balls anywhere non standard grid ball pattern Minimu...

Страница 9: ...r below the maximum value specified in Table 2 System and component level thermal enhancements are required to dissipate the heat generated and maintain the GMCH within specifications Section 3 provid...

Страница 10: ...estimate also includes a margin to account for process variation 2 5 1 2 Post Silicon Once the product silicon is available post silicon validation is performed to assess the validity of pre silicon...

Страница 11: ...To minimize these measurement errors a thermocouple attach with a zero degree methodology is recommended 3 1 1 Thermocouple Attach Methodology 1 Mill a 3 3 mm 0 13 in diameter hole centered on bottom...

Страница 12: ...of the average approach air temperature Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm 1 0 in apart Locations for both single and paired thermocouples are p...

Страница 13: ...ser may have to adjust the locations for a specific chassis Be aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an inaccurate measurement may result Measuremen...

Страница 14: ...e GMCH The potential for increased airflow speeds may be realized by ensuring that airflow from the processor thermal solution exhausts in the direction of the GMCH heat sink In addition GMCH board pl...

Страница 15: ...irflow LFM Thermal Characterization Parameter C W Sink to Ambient Case to Ambient Figure 6 Typical 1U Server Motherboard Component Placement Caution Heat sink orientation alone does not guarantee that...

Страница 16: ...oard by assembling the anchors into the board placing the heat sink over the GMCH and then fastening the clip to the anchors A thermal interface material Honeywell PCM45F is pre applied to the heat si...

Страница 17: ...ce The thickness of the gap is determined by the flatness of both the heat sink base and the die plus the thickness of the TIM and the clamping force applied by the heat sink attachment method To ensu...

Страница 18: ...nvironmental Reliability Requirements Test 1 Requirement Pass Fail Criteria 2 Mechanical Shock 3 drops for and directions in each of 3 perpendicular axes i e total 18 drops Profile 50 G trapezoidal wa...

Страница 19: ...aterial Honeywell N A PCM45F Paula Knoll 858 279 2956 Paula_knoll honeywell com CCI ACK N A Harry Lin USA 714 739 5797 hlinack aol com Monica Chih Taiwan 866 2 29952666 x131 Monica_chih ccic com tw He...

Страница 20: ...rawings Order 308643 Appendix B Mechanical Drawings This appendix contains the following mechanical drawings Drawing Name Page Number Package Drawing 21 Reference Thermal Solution Assembly 22 1U Coppe...

Страница 21: ...Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 1 Package Drawing Order 308643 21...

Страница 22: ...Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 2 Reference Thermal Solution Assembly 22 Order 308643...

Страница 23: ...Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 3 1U Copper Heat Sink Order 308643 23...

Страница 24: ...Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 4 Heat Sink Gasket 24 Order 308643...

Страница 25: ...Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 5 Torsional Heat Sink Attach Clip Order 308643 25...

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