EonStor S12S-R/G1032 Installation and Hardware Reference Manual
PSUs:
The hot-swappable PSUs supply power to the
subsystem. Power on/off is controlled by the individual power
switches on the power supply modules. Each power supply
module contains the system’s cooling module. The redundant
cooling modules ventilate the system with an airflow direction
from the front to the rear.
1.2.3 Internal
Backplane
An integrated backplane board separates the front and rear sections
of the chassis. This PCB board provides logic level signals and low
voltage power paths. Thermal sensors and I
2
C serial paths are
implemented in order to receive temperature/voltage readings and
module presence signals. This board contains no user-serviceable
components.
1.2.4 Physical
Dimensions
The S12S subsystem comes in an enhanced 2U chassis with the
following dimensions:
Measured with forearm handles: 482mm x 88mm x 516mm
(width x height x depth)
Measured without forearm handles: 446mm x 88mm x 498mm
(width x height x depth)
1.3
Major Subsystem Components
S12S houses many active components and most of them can be
accessed either through the front or the rear panel. The modular
design of these components facilitates their easy installation and
removal. Hot-swap mechanisms are incorporated to eliminate power
surges and signal glitches that might occur while removing or
installing these modules. Each component is further described
below:
1-4
Major Subsystem Components
