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IM483 Operating Instructions Revision R032306
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IM483 Operating Instructions Revision R032306
P C B H o l e P a t t e r n
The IM483-8P2 is ideal for solder-mounting into a user’s PC board design.
Figure A.7 illustrates the PCB hole pattern as well as the recommended
hole and pad diameter for the IM483-8P2.
Figure A.7: IM483-8P2 PCB Hole Pattern
R e c o m m e n d e d S o l d e r i n g P r a c t i c e s
The following practices are recommended when solder mounting the
IM483-8P2 into your PCB:
R e c o m m e n d e d S o l d e r Te m p e r a t u r e
n
315°C (600°F)
R e c o m m e n d e d S o l d e r T i m e
n
10 Seconds
R e c o m m e n d e d S o l d e r s
n
Kester “245” No-clean core solder.
n
Alpha Metals “Telecore Plus Solder.
n
Multicore “X39B” No-clean Solder.
n
Or equivalent.
R e c o m m e n d e d S o l v e n t
n
Tech Spray “Envirotech 1679”.
n
Chemtronics “Flux-off NR 2000”.
n
Or equivalent.
0.200
(5.08)
2.400
(60.96)
Hole: 8X Ø 0.041 ( 1.04) Thru
Pad: 8X Ø 0.082 (2.08)
Hole: 8X Ø 0.069 (1.75) Thru
Pad: 8X Ø 0.138 (3.50)
0.200
(5.08)