a.
Press
down
on
the
blue
touch
point
of
the
heat-sink
release
lever,
then
lift
the
lever
up
as
far
as
it
will
go
(135°)
to
release
the
baffle
assembly.
b.
Grasp
the
front
of
the
baffle
assembly
and
tip
it
up
toward
the
rear
of
the
server
while
pulling
the
rear
flange
out
of
the
heat-sink
retention
module;
then,
lift
the
baffle
assembly
up
and
out
of
the
server.
Attention:
When
you
handle
static-sensitive
devices,
take
precautions
to
avoid
damage
from
static
electricity.
For
details
about
handling
these
devices,
see
“Handling
static-sensitive
devices”
on
page
8.
7.
If
the
second
microprocessor
socket
is
covered
with
protective
film
or
a
label,
peel
and
remove
the
film
or
label.
8.
Install
the
microprocessor:
a.
Touch
the
static-protective
package
containing
the
new
microprocessor
to
any
unpainted
metal
surface
on
the
server;
then,
remove
the
microprocessor
from
the
package.
b.
Pull
out
and
lift
up
on
the
microprocessor-release
lever
to
unlock
the
microprocessor
socket.
Attention:
1)
Do
not
use
excessive
force
when
pressing
the
microprocessor
into
the
socket.
2)
Make
sure
that
the
microprocessor
is
oriented
and
aligned
correctly
with
pin
number
1
in
the
socket
before
you
try
to
close
the
microprocessor-release
lever.
The
following
illustration
shows
the
alignment
marks
for
both
microprocessors
and
sockets.
Microprocessor 2
Microprocessor 1
Microprocessor
socket 2
Microprocessor
socket 1
Alignment marks
Heat-sink
release levers
Microprocessor-
release levers
Retention bracket
springs
c.
Center
the
microprocessor
over
the
microprocessor
socket.
Align
the
triangle
on
the
corner
of
the
microprocessor
with
the
triangle
on
the
corner
of
the
socket
and
carefully
press
the
microprocessor
into
the
socket.
d.
Carefully
close
the
microprocessor-release
lever
to
secure
the
microprocessor
in
the
socket.
Chapter
2.
Installing
options
27
Содержание eServer xSeries 226Type 8648
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