HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
4
Mechanical Specifications
4.1 About This Chapter
Storage Requirement
Moisture Sensitivity
Dimensions
Customer PCB Design
4.2 Storage Requirement
The module must be stored and sealed properly in vacuum package under a
temperature below 40°C and the relative humidity less than 90% in order to ensure
the weldability within 12 months.
4.3 Moisture Sensitivity
The moisture sensitivity is level 3.
After unpacking, the module must be assembled within 168 hours under the
environmental conditions that the temperature is lower than 30°C and the
relative humidity is less than 60%. If the preceding conditions cannot be met, the
module needs to be baked according to the parameters specified in Table 4-1 .
Table 4-1
Baking parameters
Baking
Temperature
Baking
Condition
Baking Duration
Remarks
125°C±5°C
Relative humidity
≤ 60%
8 hours
Refer to JESD-033C
in detail
Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.
4.4 Dimensions
Figure 4-1 shows the dimensions of the ME309-562 module in details.
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