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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide

Figure 4-5

Recommended stencil design of LGA module (Unit: mm)

The stencil design has been qualified for HUAWEI motherboard assembly, customers can
adjust the parameters by their motherboard design and process situation to assure LGA
soldering quality and no defect.

Huawei Proprietary and Confidential

Содержание ME309-562

Страница 1: ...HUAWEI ME309 562 eMTC LGA Module Hardware Guide Issue 03 Date 2017 07 18 ...

Страница 2: ...ion or specifications contained in this manual without prior notice and without any liability DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED AS IS EXCEPT AS REQUIRED BY APPLICABLE LAWS NO WARRANTIES OF ANY KIND EITHER EXPRESS OR IMPLIED INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE MADE IN RELATION TO THE ACCURACY RELIABILITY O...

Страница 3: ... Version Date Chapter Descriptions 01 2017 03 23 Draft release 02 2017 05 26 1 Cancel SPI I2C function 2 Cancel wake_up out function use RING to replace it 3 Update the pin map interface picture because the change above Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 3 ...

Страница 4: ...ication Interfaces 10 3 1 About This Chapter 10 3 2 LGA Interface 10 4 Mechanical Specifications 20 4 1 About This Chapter 20 4 2 Storage Requirement 20 4 3 Moisture Sensitivity 20 4 4 Dimensions 20 4 5 Customer PCB Design 22 4 5 1 PCB Surface Finish 22 4 5 2 PCB Pad Design 22 4 5 3 Solder Mask 24 4 5 4 Requirements on PCB Layout 24 4 5 5 Stencil Design 24 Huawei Proprietary and Confidential Copyr...

Страница 5: ...nterfaces provided by HUAWEI ME309 562 eMTC LGA module hereinafter referred to as the ME309 562 module This document helps hardware engineer to understand the interface specifications electrical features and related product information of the ME309 562 module Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 5 ...

Страница 6: ...9 562 module features Feature Description Physical Dimensions Dimensions W L H 18 mm 24 mm 2 5 mm Weight TBD Operating Bands HD FDD LTE Band 2 Band 4 Band 12 Band13 Operating Temperature Normal operating temperature 30 C to 75 C Characteristics guaranteed Extended operating temperature 1 40 C to 85 C Normal working Storage Temperature 40 C to 95 C Power Voltage 3 3 V to 4 2 V 3 8 V is recommended ...

Страница 7: ...r on off interface Hardware reset interface Wake in out interface Antenna Interface RF antenna pad x 1 Data Services LTE FDD DL 300kbps UL 375kbps 1 4MHz BW catM1 1 When the ME309 562 module works at 40 C to 30 C or 75 C to 85 C NOT all its RF performances comply with the 3GPP specifications 2 3 Circuit Block Diagram Figure 2 1 shows the circuit block diagram of the ME309 562 module The major func...

Страница 8: ...face The module supports 3 UART interfaces Two are 4 wire UARTs and the other one is 8 wire UART Uart02 is only for debugging SIM Interface The SIM interface provides the interface for a SIM card GPIO General Purpose I O pins External Power Supply DC 3 8 V is recommended ADC Analog to Digital Converter I2C Inter Integrated Circuit Huawei Proprietary and Confidential Copyright Huawei Technologies C...

Страница 9: ...HUAWEI ME309 562 eMTC LGA Module Hardware Guide SPI Serial Peripheral Interface RF Pad RF antenna interface Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 9 ...

Страница 10: ...chapter mainly describes the external application interfaces of the ME309 562 module LGA Interface 3 2 LGA Interface The ME309 562 module uses a 120 pin LGA as its external interface For details about the module and dimensions see 4 4 Dimensions Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 10 ...

Страница 11: ... Module Hardware Guide Figure 3 1 Pin map of LGA interface Top view Update 26 05 2017 Figure 3 2 Appearance of ME309 562 module without label Top View Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 11 ...

Страница 12: ...0 0 54 C6 UART0_DSR O UART0 data set ready VOH 1 44 1 8 1 8 VOL 0 0 36 B6 UART0_DCD O UART0 data carrier detect VOH 1 44 1 8 1 8 VOL 0 0 36 A6 UART0_RING O UART0 ring indicator VOH 1 44 1 8 1 8 Use as wake_up out VOL 0 0 36 A4 UART1_TX O UART1 transmit output VOH 1 44 1 8 1 8 VOL 0 0 36 A5 UART1_RX I UART1 receive data input VIH 1 26 1 8 1 8 VIL 0 0 54 B4 UART1_CTS I UART1 clear to send VIH 1 26 1...

Страница 13: ...ted data master out VOH 1 44 1 8 1 8 NOT support VOL 0 0 36 C1 SPI_MISO I Serial data line for received data master in VIH 1 26 1 8 1 8 NOT support VIL 0 0 54 G1 I2C_SCL O I2C bus serial clock line need pull up to VCC_EXT VOH 1 44 1 8 1 8 NOT support VOL 0 0 36 H1 I2C_SDA I O I2C bus serial data line need pull up to VCC_EXT VOH 1 44 1 8 1 8 NOT support VOL 0 0 36 VIH 1 26 1 8 1 8 VIL 0 0 54 D9 SIM...

Страница 14: ...L Sleep mode is enabled default L VIH 1 26 1 8 1 8 VIL 0 0 54 L3 WAKEUP_OUT O Module wakes up the host VOH 1 44 1 8 1 8 NOT support please use RING as wake_up out VOL 0 0 36 K3 SLEEP_STATUS O Sleep status indicator H The module is in wakeup state L The module is in sleep state VOH 1 44 1 8 1 8 VOL 0 0 36 J8 LED_MODE O Network mode indicator VOH 1 44 1 8 1 8 VOL 0 0 36 E8 GPIO1 I O General Purpose ...

Страница 15: ...1 8 1 8 Default configuration is input pull down VOL 0 0 36 VIH VIH 1 26 1 8 VIL VIL 0 L2 JTAG_TMS I JTAG test mode select VIH 1 26 1 8 1 8 VIL 0 0 54 M2 JTAG_TRST_N I JTAG test reset VIH 1 26 1 8 1 8 VIL 0 0 54 K2 JTAG_TCK I JTAG test clock VIH 1 26 1 8 1 8 VIL 0 0 54 L1 JTAG_TDO O JTAG test data output VOH 1 44 1 8 1 8 VOL 0 0 36 M1 JTAG_TDI I JTAG test serial data input VIH 1 26 1 8 1 8 VIL 0 0...

Страница 16: ...se design a pull high resister to VCC_EXT and a pull down resister to Ground on your board default pull high resister is on the PCB board VIL 0 0 54 K10 VCC_EXT PO Pin for external power output 1 71 1 8 1 89 Max current is 10mA L9 VCC_Module PI Power supply Input 3 3 3 8 4 2 Max current is about 300mA L10 VCC_Module PI Power supply input 3 3 3 8 4 2 P3 RF_ANT RF RF pin of module A3 Reserved Reserv...

Страница 17: ... Reserved Reserved please keep this pin open H9 Reserved Reserved please keep this pin open C5 Reserved Reserved please keep this pin open G2 Reserved Reserved please keep this pin open G3 Reserved Reserved please keep this pin open H2 Reserved Reserved please keep this pin open H3 Reserved Reserved please keep this pin open P8 Reserved Reserved please keep this pin open C4 Reserved Reserved pleas...

Страница 18: ...Ground B10 GND Ground C8 GND Ground E1 GND Ground E5 GND Ground E6 GND Ground E10 GND Ground F5 GND Ground F6 GND Ground G5 GND Ground G6 GND Ground H5 GND Ground H6 GND Ground H10 GND Ground J2 GND Ground J5 GND Ground J6 GND Ground J9 GND Ground K5 GND Ground K6 GND Ground K9 GND Ground M3 GND Ground M4 GND Ground M5 GND Ground M6 GND Ground Huawei Proprietary and Confidential Copyright Huawei T...

Страница 19: ...for digital signal output AI indicates pins for analog signal input PI indicates power input pins PO indicates power output pins P indicates power pins VIL indicates low level input voltage VIH indicates high level input voltage VOL indicates low level output voltage VOH indicates high level output voltage The NC Not Connected pins are floating and there are no signal connected to these pins The R...

Страница 20: ...e must be assembled within 168 hours under the environmental conditions that the temperature is lower than 30 C and the relative humidity is less than 60 If the preceding conditions cannot be met the module needs to be baked according to the parameters specified in Table 4 1 Table 4 1 Baking parameters Baking Temperature Baking Condition Baking Duration Remarks 125 C 5 C Relative humidity 60 8 hou...

Страница 21: ...Unit mm The detail information about the corner and the module pin description top view 1 the yellow pins diameter is 0 76 mm pitch is 1 35 mm 2 the blue pins diameter is 0 89 mm pitch is 1 60 mm Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 21 ...

Страница 22: ...on Gold ENIG Organic Solderability Preservative OSP may also be used ENIG preferred 4 5 2 PCB Pad Design To achieve assembly yields and solder joints of high reliability it is recommended that the PCB pad size be designed as follows Figure 4 2 Footprint design of customer s PCB Unit mm Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 22 ...

Страница 23: ...he yellow pins diameter is 0 71 mm pitch is 1 35 mm 2 the blue pins diameter is 0 81 mm pitch is 1 60 mm Figure 4 3 Detail information about the recommend module footprint Figure 4 4 Recommended Package Size on HUAWEI motherboard Unit mm Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 23 ...

Страница 24: ...GA module rework requirement and other sides with 0 6 mm The minimum distance between the LGA module and the PCB edge is 0 3 mm When the PCB layout is double sided the LGA module must be placed on the second side for assembly so as to avoid module dropped from PCB or component located in module re melding defects caused by uneven weight Customers PCB together with ME309 562 should be placed in an ...

Страница 25: ... module Unit mm The stencil design has been qualified for HUAWEI motherboard assembly customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 25 ...

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