HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
4.5.3
Solder Mask
Non Solder Mask Defined (NSMD) is recommended. In addition, the solder mask of
the NSMD pad design is larger than the pad so the reliability of the solder joint can be
improved.
The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side
of the solder mask must be 50 µm–75 µm larger than the pad. The specific size
depends on the processing capability of the PCB manufacturer.
4.5.4
Requirements on PCB Layout
To reduce deformation, a thickness of at least 1.0 mm is recommended.
Other devices must be located more than 3 mm (5 mm recommended) away
from the two parallel sides of the LGA module (rework requirement),and other
sides with 0.6 mm. The minimum distance between the LGA module and the
PCB edge is 0.3 mm.
When the PCB layout is double sided, the LGA module must be placed on the
second side for assembly; so as to avoid module dropped from PCB or
component (located in module) re-melding defects caused by uneven weight.
Customers PCB together with ME309-562 should be placed in an enclosed box
to reduce the impact of high humidity as far as possible.
The bottom of the module is not allowed to put non-ground line or non-ground
hole. If the design can not be achieved, then the non-gound line and hole must
be covered by green oil.
4.5.5
Stencil Design
It is recommended that the stencil for the LGA module be 0.15 mm in thickness. The
stencil design is shown as Figure 4-5 :
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