
Issue
Date
Description
18
2018-02-22
Added the description about how to import and
export the iBMC/BIOS configuration information
after the mainboard is replaced. For details, see
.
17
2018-01-15
Added the locations of dual SD cards. For details,
see
Added the description about the left and right
mounting ears. For details, see
16
2017-12-12
Modified server installation environment
requirements. For details, see
.
Added steps about removing and installing the
mezzanine SD card. For details, see
Added fan module numbers. For details, see
.
15
2017-10-26
Added the description about Dual-SD cards and SD
card module. For details, see
14
2017-09-26
Modified the logical structure. For details, see
13
2017-08-15
Optimized chapters about parts replacement. For
details, see
.
12
2017-07-20
Added the description about 128 GB DIMMs. For
details, see
.
11
2017-06-20
Added internal cable BOMs. For details, see
10
2017-05-10
Modified the mainboard layout description. For
details, see
.
09
2017-04-05
Modified front bezel description. For details, see
(Optional) Removing the Front Bezel
(Optional) Installing the Front Bezel
.
08
2017-03-03
Modified the indicator status description of NVMe
PCIe SSDs. For details, see
.
07
2017-01-24
Added operations for replacing the front bezel. For
details, see
7.3 (Optional) Removing the Front
and
7.4 (Optional) Installing the Front
.
5288 V3 Server
User Guide
About This Document
Issue 26 (2018-11-19)
Copyright © Huawei Technologies Co., Ltd.
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