Hewlett Packard Enterprise HPE ProLiant XL170r Gen10, Руководство по техническому обслуживанию и ремонту

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• The processor does not support enhanced processor performance.
• LFF drives with drive capacities greater than or equal to 10 TB are not supported for the Apollo r2200 Gen10 Chassis
series with three drives per node.
Description Chassis Fan configuration Number of drives
supported by the server Maximum inlet
ambient
temperature
Processor with a
TDP of 135 W
or more, except
G6244 Apollo r2200 Gen10
Chassis
(12 LFF backplane)
Redundant and
nonredundant 3 drives
1
28°C (82.4°F)
3 drives
2
Not supported
0 to 2 drives
3
35°C (95°F)
Apollo r2600 Gen10
Chassis
(24 SFF or 16 SFF + 8
NVMe backplane)
Redundant and
nonredundant 0 to 6 drives 30°C (86°F)
Apollo r2800 Gen10
Chassis
(24 SFF backplane with
SAS expander)
Redundant and
nonredundant 0 to 24 drives 30°C (86°F)
Apollo r2800 Gen10
Chassis
(16 NVMe backplane)
Redundant and
nonredundant 0 to 4 drives 30°C (86°F)
Intel Xeon Gold
6244 Apollo r2200 Gen10
Chassis
(12 LFF backplane)
Redundant and
nonredundant 3 drives
1
Not supported
3 drives
2
Not supported
0 to 2 drives
3
Not supported
Apollo r2600 Gen10
Chassis
(24 SFF or 16 SFF + 8
NVMe backplane)
Redundant and
nonredundant 0 to 6 drives Not supported
Apollo r2800 Gen10
Chassis
(24 SFF backplane with
SAS expander)
Redundant and
nonredundant 0 to 24 drives Not supported
Apollo r2800 Gen10
Chassis
(16 NVMe backplane)
Redundant and
nonredundant 0 to 4 drives Not supported
Processor with a
TDP between
115 W and 130
W Apollo r2200 Gen10
Chassis
(12 LFF backplane)
Redundant and
nonredundant 3 drives
1
30°C (86°F)
3 drives
2
Not supported
0 to 2 drives
3
35°C (95°F)
Table Continued
98
Specifications