Freescale Semiconductor MCIMX53SMD, Руководство пользователя по оборудованию

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MCIMX53SMD Board Hardware User’s Guide, Rev. 0
Freescale Semiconductor
200mm
Figure 8-1. MCIMX53SMD Board Dimensions
The MCIMX53SMD board PCB was made by using the standard 8-layer technology. The material used was FR-4
Hi Temp. The board stack up is as follows:

Top Layer

Ground-1 Layer

Signal-1 Layer

GND/Power-1 Layer

GND/Power-2 Layer

Signal-2 Layer

Ground-2 Layer

Bottom Layer
The stack up information provided by the PCB Fabrication Facility is as shown in Table 8-1. Widths and
thickness are shown in mils (1 mils equals to 0.0254 millimeters). Impedances are shown inΩ. The material
used in calculating this stack up was 370HR.
166mm
166mm
166mm
166mm
166mm
166mm
166mm
166mm