Copyright
©
2015
congatec
AG
PA3Cm11
19/81
4
Cooling Solution
The conga-PA3 SBC offers Ultra Low Power boards with high computing performance and outstanding graphics. Due to its low power
consumption, the SBC generates less heat and therefore requires less active cooling, allowing the use of quieter, lower profile coolers that are
better suited to small form factor systems.
Nonetheless, all electronics contain semiconductor devices which have operating temperature ranges that should be adhered to. This means
that for reliable operation, the thermal design of the conga-PA3 must be carefully considered. For this reason, it is imperative to provide
suf
ficient air flow to each of the components, to ensure the specified operating temperature of the conga-PA3 is maintained.
congatec AG offers two cooling solutions for the conga-PA3:
•
A congatec passive cooling solution (CSP).
•
A congatec heatspreader. The heatspreader features a Gap Pad, heatstack and a Hi-Flow 225UT pressure sensitive, phase change thermal
interface.
The dimensions of the cooling solutions are shown below. All measurements are in millimeters. To mount the system, follow the valid DIN/ISO
specification.
The maximum torque specification for all screws is 0.3 Nm. Higher torque may damage the SBC.
Note
You can also use a custom cooling solution for the conga-PA3. When a passive cooling is used, the end user must ensure that adequate air
flow is maintained.
See section 1.2.2 “Optional Accessories” for the part numbers of the cooling accessories. For the dimensions of the CSP and heatspreader,
see sections 4.1 and 4.2.
Passive Cooling Solution
Heatspreader
