Summit X670 Series Switches
Summit Family Switches Hardware Installation Guide
481
NOTE
For the technical specifications of power supplies for the Summit X670 series switches, see
“Summit
550 W Power Supplies” on page 490
.
International EMC certifications
CISPR 22: 2008 (Ed 6.0), Class A (International Emissions)
EN 55024:1998+A1:2001+A2:2003 Class A (International Immunity)
IEC/EN 61000-4-2:2008 Electrostatic Discharge, 8kV Contact, 15 kV Air,
Criteria A
IEC/EN 61000-4-3:2008 Radiated Immunity 10V/m, Criteria
IEC/EN 61000-4-4:2004 Transient Burst, 1 kV, Criteria A
IEC/EN 61000-4-5:2005 Surge, 2 kV L-L, 2 kV L-G, Level 3, Criteria A
IEC/EN 61000-4-6:2008 Conducted Immunity, 0.15-80 MHz,
10V/m unmod. RMS, Criteria A
IEC/EN 61000-4-11:2004 Power Dips & Interruptions, >30%,
25 periods, Criteria C
Country-specific
VCCI Class A (Japan Emissions)
BSMI (Taiwan Emissions)
ACMA (C-Tick) (Australia Emissions)
CCC Mark (China)
KCC Mark, EMC Approval (Korea)
Telecom Standards
EN/ETSI 300 386:2008 (EMC Telecommunications)
EN/ETSI 300 019 (Environmental for Telecommunications)
MEF9 and MEF14 certified for EPL, EVPL, and ELAN
IEEE 802.3 Media Access
Standards
IEEE 802.3ab 1000BASE-T
IEEE 802.3z 1000BASE-X
IEEE 802.3ae 10GBASE-X
IEEE 802.3ba 40GBASE-X
Environmental Data
Environmental standards
EN/ETSI 300 019-2-1 v2.1.2 (2000 - 2009) - Class 1.2 Storage
EN/ETSI 300 019-2-2 v2.1.2 (1999 - 09) - Class 2.3 Transportation
EN/ETSI 300 019-2-3 v2.1.2 (2003 - 04) - Class 3.1e Operational
EN/ETSI 300 753 (1997-10) - Acoustic Noise
ASTM D3580 Random Vibration Unpackaged 1.5G
Operating conditions
Temperature range: 0° C to 45° C (32° F to 113° F)
Humidity: 10% to 95% relative humidity, non-condensing
Altitude: 0 to 3,000 meters (9,850 feet)
Operational shock (half sine): 30 m/s
2
(3 G), 11 ms, 60 shocks
Operational random vibration: 3 to 500 Hz at 1.5 G rms
Storage & transportation
conditions (packaged)
Transportation temperature: -40° C to 70° C (-40° F to 158° F)
Storage and transportation humidity: 10% to 95% relative humidity,
non-condensing
Packaged shock (half sine): 180 m/s
2
(18 G), 6 ms, 600 shocks
Packaged sine vibration: 5 to 62 Hz at velocity 5 mm/s,
62 to 500 Hz at 0.2 G
Packaged random vibration: 5 to 20 Hz at 1.0 ASD w/–3 dB/oct.
from 20 to 200 Hz
14 drops minimum on sides and corners at 42 inches (<15 kg box)
Acoustic noise
Summit X670-48x
56.6 dB(A) min
Table 90: Summit X670 Series Switch Technical Specifications (Continued)
Содержание Summit X150 Series
Страница 14: ...Preface Summit Family Switches Hardware Installation Guide 14...
Страница 15: ...PA R T About the Summit Family Switches...
Страница 16: ......
Страница 156: ...Chapter 2 Summit Power Supplies Summit Family Switches Hardware Installation Guide 156...
Страница 173: ...PA R T Installing the Hardware...
Страница 174: ......
Страница 190: ...Chapter 4 Site Preparation Summit Family Switches Hardware Installation Guide 190...
Страница 230: ...Chapter 5 Building a SummitStack Configuration Summit Family Switches Hardware Installation Guide 230...
Страница 300: ...Chapter 6 Installing Summit Family Switches Summit Family Switches Hardware Installation Guide 300...
Страница 338: ...Chapter 8 Installing Optional Ports Summit Family Switches Hardware Installation Guide 338...
Страница 339: ...PA R T Maintenance Procedures...
Страница 340: ......
Страница 382: ...Chapter 12 Replacing Port Option Cards and VIMs Summit Family Switches Hardware Installation Guide 382...
Страница 399: ...PA R T Appendices...
Страница 400: ......
Страница 503: ...Japan VCCI Class A Summit Family Switches Hardware Installation Guide 503...
Страница 504: ...Appendix B Technical Specifications Summit Family Switches Hardware Installation Guide 504...
Страница 512: ...Index Summit Family Switches Hardware Installation Guide 512...