53
WARNING
The thermal design of the host PC must ensure that, at any time, the FPGA
die temperature never exceeds the recommended limit.
WARNING
Exceeding the upper limit of the FPGA die temperature can permanently
damage the card.
NOTE
For PCIe/104 products only, the ambient air temperature specification
applies to any point in the vicinity of the module including the gap between
modules of the PCIe/104 stack.
4.2. Temperature Monitor
FPGA die temperature sensor
All Coaxlink cards embed a temperature sensor on the FPGA die.
When the
TemperatureSensorSelector
feature of the Interface Module is set to
Grabber
, the
Temperature
feature of the Interface Module reports the FPGA die temperature expressed in °C.
The user application is invited to check regularly the FPGA die temperature to ensure that the
board operates within the specified operating limits.
See also:
"Environmental Conditions" on the previous page
Coaxlink
Hardware Manual
Содержание Coaxlink 1629
Страница 4: ...4 1 About This Document 1 1 Document Scope 5 Coaxlink Hardware Manual ...
Страница 7: ...7 2 1 Board and Bracket Layouts Coaxlink Hardware Manual ...
Страница 9: ...9 2 2 Connectors Coaxlink Hardware Manual ...
Страница 17: ...17 2 3 LEDs Coaxlink Hardware Manual ...
Страница 33: ...33 3 3 Power Distribution Schemes Coaxlink Hardware Manual ...
Страница 64: ...64 6 Appendix Appendix to Coaxlink cards hardware manual Coaxlink Hardware Manual ...