52
4.1. Environmental Conditions
Storage and operating conditions specification of standard climatic class products
Storage Conditions
Applies to:
Parameter
Conditions
Min
Max
Units
Ambient air temperature
-20 [-4]
70 [158]
°C [°F]
Ambient air humidity
Non-condensing
10
90
% RH
Applies to:
Parameter
Conditions
Min
Max
Units
Ambient air temperature
TBD
70 [158]
°C [°F]
Ambient air humidity
Non-condensing
TBD
TBD
% RH
Operating Conditions
Applies to:
Parameter
Conditions
Min
Max
Units
FPGA die temperature
80 [176]
°C [°F]
Ambient air temperature
0 [32]
55 [131]
°C [°F]
Ambient air humidity
Non-condensing
10
90
% RH
Applies to:
Parameter
Conditions
Min
Max
Units
FPGA die
temperature
100
[212]
°C
[°F]
Ambient air
temperature
Conduction-cooling
-40 [-
40]
85
[185]
°C
[°F]
Ambient air
humidity
Non-condensing
0
100
%
RH
Shock amplitude
All axes – 11 ms duration – Half-sine and saw tooth
pulse shapes
20
g
Coaxlink
Hardware Manual
Содержание Coaxlink 1629
Страница 4: ...4 1 About This Document 1 1 Document Scope 5 Coaxlink Hardware Manual ...
Страница 7: ...7 2 1 Board and Bracket Layouts Coaxlink Hardware Manual ...
Страница 9: ...9 2 2 Connectors Coaxlink Hardware Manual ...
Страница 17: ...17 2 3 LEDs Coaxlink Hardware Manual ...
Страница 33: ...33 3 3 Power Distribution Schemes Coaxlink Hardware Manual ...
Страница 64: ...64 6 Appendix Appendix to Coaxlink cards hardware manual Coaxlink Hardware Manual ...