ETAS
Installation
FETK-T3.0 - User’s Guide
32
5
Installation
In this chapter, the hardware installation of the FETK-T3.0 is described.
5.1
Mounting the FETK-T3.0 to the ECU Housing
5.1.1
Thermal Connection Requirements
To ensure proper operation of the FETK-T3.0 over the specified temperature
range, the FETK-T3.0 must be mounted to the ECU metal housing using the
enclosed Gap Pad. This enables thermal dissipation of the electronic compo-
nents used on the FETK-T3.0 to the ECU housing. This chapter describes an
example for mounting the FETK-T3.0 to the ECU housing.
The ECU housing should be of a size and material (such as Aluminum), which
gives a thermal conductivity of at least 150 W/ (m · K ) at the FETK-T3.0 mount-
ing position. The typical power dissipation for the FETK-T3.0 at 12V, 110°C is
5.2W. For additional details on power dissipation, please see“Environmental
Conditions” on page 46.
CAUTION
Some components of the interface board may be damaged or destroyed by
electrostatic discharges. Please keep the board in its storage package until
it is installed.
The board should only be taken from its package, configured, and installed at
a work place that is protected against static discharge.
CAUTION
Risk of short circuiting the internal signals of the FETK-T3.0! When you mount
the FETK-T3.0 to the ECU, you must ensure that any screws and washers
used will not penetrate the FETK printed circuit board.
CAUTION
Risk of thermal damage to the FETK-T3.0!
For all mounting methods of the FETK-T3.0 to the ECU housing, the thermal
gap pad must be used.