23 PACKAGE
23-2
Seiko Epson Corporation
S1C17M20/M21/M22/M23/M24/M25
TECHNICAL MANUAL (Rev. 1.0)
SQFN5-32 package (S1C17M20/M23)
(Unit: mm)
4.9
min
/5.1
max
0.35
min
/0.45
max
8
17
1
24
9
32
16
25
INDEX
EXPOSED DIE PAD
4.9
min
/5.1
max
0
min
1
max
Top View
Bottom View
0.2
min
/0.3
max
0.5
3.0
min
/3.2
max
C0.3
3.0
min
/3.2
max
Figure 23.2 SQFN5-32 Package Dimensions
*
The potential of the EXPOSED DIE PAD is the same as that of the substrate potential (V
SS
) on the back of the IC.