Devices
S1
C
17xxx
F
00E1
Packing specifications
00 : Besides tape & reel
0A : TCP BL
2 directions
0B : Tape & reel BACK
0C : TCP BR
2 directions
0D : TCP BT
2 directions
0E : TCP BD
2 directions
0F : Tape & reel FRONT
0G : TCP BT
4 directions
0H : TCP BD
4 directions
0J : TCP SL
2 directions
0K : TCP SR
2 directions
0L : Tape & reel LEFT
0M : TCP ST
2 directions
0N : TCP SD
2 directions
0P : TCP ST
4 directions
0Q : TCP SD
4 directions
0R : Tape & reel RIGHT
99 : Specs not fixed
Specification
Package
D: die form; F: QFP, B: BGA, WCSP
Model number
Model name
C: microcomputer, digital products
Product classification
S1: semiconductor
Development tools
S5U1
C
17000
H2
1
Packing specifications
00: standard packing
Version
1: Version 1
Tool type
Hx : ICE
Dx : Evaluation board
Ex : ROM emulation board
Mx : Emulation memory for external ROM
Tx : A socket for mounting
Cx : Compiler package
Sx : Middleware package
Yx : Writer software
Corresponding model number
17xxx: for S1C17xxx
Tool classification
C: microcomputer use
Product classification
S5U1: development tool for semiconductor products
00
00
Configuration of product number
CONFIGURATION OF PRODUCT NUMBER
S1C17F13 TeChniCal Manual
Seiko epson Corporation
i
(Rev. 1.0)
Configuration of product number