Embedian SMARC-iMX8M Series, Руководство пользователя, Страница: 110 / 174

Embedian, Inc.
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SMARC-iMX8M Computer on Module User’s Manual v.1.0
Figure 23: Heat Spreader
The internal square in the figure above is a thermally conductive and
mechanically compliant Thermal Interface Material (or “TIM”). The exact X‐Y
position and Z thickness details of the TIM vary from design to design.
The two holes immediately adjacent to the TIM serve to secure the PCB in
the SOC area and compress the TIM.
The four interior holes that are further from the center allow a heat sink to
be attached to the heat spreader plate, or they can be used to secure the
heat spreader plate to a chassis wall that serves as a heat sink.
Dimensions and further details may be found in the following figure.