
Manufacturing information
Recommended footprint
XBee/XBee-PRO® S2C ZigBee® RF Module
301
Match the solder footprint to the copper pads, but may need to be adjusted depending on the specific
needs of assembly and product standards. Recommended stencil thickness is 0.15 mm/0.005”. Place
the component last and set the placement speed to the slowest setting.
While the underside of the device is mostly coated with solder resist, we recommended the copper
layer directly below the device be left open to avoid unintended contacts. Copper or vias must not
interfere with the three exposed RF test points on the bottom of the device as shown in the following
diagram. These devices have a ground plane in the middle on the back side for shielding purposes,
which can be affected by copper traces directly below the device.
Содержание XBee
Страница 1: ...XBee XBee PRO S2C ZigBee RF Module User Guide ...
Страница 259: ...AT commands Execution commands XBee XBee PRO S2C ZigBee RF Module 259 Parameter range N A Default N A ...
Страница 289: ...Regulatory information ANATEL Brazil XBee XBee PRO S2C ZigBee RF Module 289 ...
Страница 290: ...Regulatory information ANATEL Brazil XBee XBee PRO S2C ZigBee RF Module 290 ...
Страница 303: ...Load ZigBee firmware on 802 15 4 devices Background 304 Load ZB firmware 305 XBee XBee PRO S2C ZigBee RF Module 303 ...