O V E R V I E W
Data Device Corporation
DS-BU-67301B-G
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Table 1. Total-AceXtreme® Series Specifications
PARAMETER
MIN
TYP
MAX
UNITS
1553 MESSAGE TIMING
BC Intermessage Gap (Note 7)
10
µs
BC/RT/MT No-Response Timeout – mid-parity-to-mid-sync
programmable range (Note 8)
4
511.5
µs
RT Response Time (mid-parity to mid-sync)
4
—
7
µs
Transmitter Watchdog Timeout
—
660.5
—
µs
THERMAL
TOTAL-ACEXTREME BGA 324-BALL BGA PACKAGE
(See Thermal Management Section)
Active Transceiver
• Junction Temperature (T
J
)
• Junction-to-Ambient (
θ
JA via simulation)
150
°C
- Per JESD 51-2 standard at 25°C
θ
JA
in Still Air
—
68.8
—
°C/W
THERMAL (Con’t)
- Per JESD 51-6 standard at 25°C
θ
JA
@ 1M/S
—
52.9
—
°C/W
θ
JA
@ 2M/S
—
47.1
—
°C/W
θ
JA
@ 3M/S
—
43.6
—
°C/W
• Junction-to-case (
θ
JC
via simulation)
- Per JESD 51-12 standard at 25°C
θ
JC
—
24.5
—
°C/W
• Junction-to-board (
θ
JB
via simulation)
- Per JESD 51-8
θ
JB
—
46.9
—
°C/W
ALL PACKAGES
Operating Case Temperature
- EXX
-40
—
+100
°C
- 1XX (Note 11)
-55
—
+125
°C
Operating Junction Temperature
- Transceiver
-55
—
+150
°C
- Protocol
-55
—
+135
°C
Storage Temperature
-65
—
+150
°C
SOLDERING
324-BALL BGA PACKAGE
The reflow profile detailed in IPC/JEDEC J-STD-020 is applicable for both the leaded and lead-free versions of Total-
AceXtreme.