Document Number: 002-10689 Rev *H
Page 55 of 166
S6J32E, S6J32F, S6J32G Series
7.1.2
Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering,
you should only mount under Cypress
’s recommended conditions. For detailed information about mount conditions, contact your
sales representative.
Lead Insertion Type
You can mount lead-insertion type packages on printed circuit boards by two methods: direct soldering on the board or mounting
by using a socket.
Direct mounting on boards normally involves processes for inserting leads into through-holes on the board and using the flow
soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be
subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to
Cypress-recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact
deterioration after long periods. For this reason, it is recommended that you verify the surface treatment of socket contacts and IC
leads before mounting.
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily
deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open
connections caused by deformed pins, or shorting due to solder bridges.
Use appropriate mounting techniques. Cypress recommends the solder reflow method and has established a ranking of mounting
conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended
conditions.
Pb-free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction
strength may be reduced under some conditions of use.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption
of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel,
reducing moisture resistance and causing packages to crack. To prevent, do the following:
1. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in
locations where temperature changes are slight.
2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between
5
˚C and 30 ˚C. For dry packages, the recommended relative humidity range is 40% to 70%.
3. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a
silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.
4. Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended
conditions for baking.
Condition: 125
˚C/24 h
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