Crystal Vision
Specification
TANDEM HD-20 User Manual R1.4
50
24/05/2007
7 Specification
TANDEM HD-20 motherboard
General
Dimensions
100mm x 266mm module with DIN 41612 connector
Weight
260g with two sub PCBs fitted
Power
consumption
12W max, dependent on sub PCBs fitted
Processing
10-bit. Active picture only.
Inputs
Video
HD or SD SDI 270Mb/s to 1.485Gb/s serial digital compliant to EBU
3267-E, SMPTE 259M and SMPTE 292M
Cable
equalisation
>200m Belden 8281 or equivalent (video)
HD (1.485Gb/s) – 100 metres (Belden 1694 or equivalent up to 140m)
SD (270Mb/s) >250 metres
Standard selection
625, 525, 1080i 50/59.94/60, 1035 59.94/60, 720p 50/59.94/60
Automatic selection, output always follows input standard
Input return loss
-15dB for 5MHz to 1.5GHz
Audio inputs
SD embedded to SMPTE 272M
HD embedded to SMPTE 299M
Analogue or AES dependent on sub-modules fitted
Outputs
Video
Two HD or SD SDI 270Mb/s to 1.485Gb/s serial digital compliant to
SMPTE 259M and SMPTE 292M with two buffered input loop-throughs.
Jitter
Typically SDI 0.2UI @ 1kHz, HD 0.2UI @ 100kHz
Audio
SD embedded to SMPTE 272M
HD embedded to SMPTE 299M
Analogue or AES dependent on sub-modules fitted
Embed/de-embed timing
Inter-channel: <1 clock cycle
Audio to video: SD approx. 800us, HD approx. 90us