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REPAIR AND REPLACEMENT PROCEDURES
COMPONENT REMOVAL AND INSTALLATION PROCEDURES
8 - 4
WBPEEUI110506A0
8. Carefully remove the cell and characterization board
assembly, feeding the cell cable and characterization board
through the opening left in the electronics housing by the cell.
9. Remove the cell and cover O-rings (Fig.
).
Cell and Characterization Board Assembly Installation
1. Refer to
and determine the proper replacement
cell and cover O-rings for the application.
2. Coat the O-rings with a film of Dow Corning No. 4 com-
pound and install.
3. Coat the upper portion of the cell with a light coating of the
DRI-GLIDE sealant.
4. Feed the characterization board and cell cable through the
opening in the bottom of the electronics housing, being careful
not to damage the cell cable.
5. Mount the cell into the electronics housing so that the flat
on the cell faces the hole for the cell lock.
6. Install the cell lock and tighten the cell locking screw
(Fig.
).
7. Mount the characterization board to the electronics hous-
ing and install the two screws (Fig.
8. Align the rectangular opening on the bottom of the ampli-
fier assembly with the characterization board connector and
install the amplifier assembly into the electronics housing.
Gently press it down to seat the mating connectors.
9. Install the three screws to secure the amplifier assembly to
the electronics housing.
10. Grease the threads of the housing cover with a light film of
the DRI-GLIDE sealant.
11. Install the housing cover.
NOTE: There will be a delay after initial power up when a new cell
and characterization board assembly and amplifier assembly are
mated.
12. If this is a new cell and characterization board assembly,
and a configuration other than the standard factory configura-
tion is desired (Table
), perform the configuration proce-
dures in
13. Perform the calibration procedures in
.
Содержание platinum standard PTSP Series
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