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Model 300T2G8
Amplifier gain is determined by the solid state preamp (SSA), which has a voltage-controlled attenuator. The
control head determines the output of a digital-to-analog converter (DAC) on the HPA interface board. The output
of the DAC controls the SSA attenuator. The remote control board (A24369-000) mounted behind the front panel
is provided with a circuit that increases the attenuation so that reverse power is limited to a safe level (on the order
of 20 to 50 watts). In emergency bypass operation (see section 3.7) the attenuator signal is provided locally on the
remote control board. The foldback circuit remains on line in emergency bypass operation.
2.3 DESCRIPTION
OF
THE POWER SUPPLY (A22520-052)
The TWT power supply is of modular construction. Low voltage power for logic and control of the entire power
supply assembly, the preamplifier, and the HPA interface board is provided by the low voltage power supply
module (A23687-001). Control logic and TWT protection circuits are contained in the HPA logic and Control
Assembly (A16485-000).
The Heater Power Supply Module (A10010-000) powers the TWT DC heater. Bias and pulse top voltage for the
TWT grid are provided by the Modulator Assembly (A21422-101).
The high voltage power supply consists of the following: the Power Factor Correction module (A23683-000)
converts line voltage to DC for the high voltage switching supply. Switching transistors are on the Power Board
Assembly (A16487-001), and switching is controlled by the Pulse Width Modulation (PWM) Board (A10017-
051). The high voltage transformer and rectifiers are contained in the High Voltage Diode/Cap Assembly
(A21455-050). The high voltage DC is filtered in the HV Filter Assembly (A21461-005).
Interconnects between the power supply modules are through a motherboard. It is installed in a finned heat sink
assembly to which the modules are bolted. The heat sink is cooled by the incoming cabinet air. The Heat
Sink/Motherboard assembly is A24357-000.
8
Rev A
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