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[AK4675]
MS0963-E-00
2008/05
- 177 -
PACKAGE
5.
5
±
0.
1
5.5
±
0.1
0.5
A
B
C
D
E
F
G
8
7
6
5
4
3
1
83 -
φ
0.3
±
0.05
H
J
10 9
0.08
S
S
φ
0.05
AB
S
B
0.5
M
A
4.5
1.
2
M
AX
0.
25
±
0.0
5
2
K
̈
Material & Lead finish
Package
molding
compound: Epoxy
Interposer material: BT resin
Solder
ball
material: SnAgCu