29
1
FIN2
I
For the connection of the pickup photodiode. Addition to the FIN1 pin creates an RF
signal and subtraction from it create an EF signal.
2
FIN1
I
For the connection of the pickup photodiode.
3
E
I
For the connection of the pickup photodiode. Subtraction from the F pin creates a TE
signal.
4
F
I
For the connection of the pickup photodiode.
5
TB
I
Inputs the DC components in the TE signal.
6
TE
I
For the connection of a resistor which sets the gain of the TE signal between this pin
and the TE pin.
7
TE
O
TE signal output.
8
TESI
I
TES (track error sense) comparator input. The TE signal is passed through a BPF.
9
SCI
I
Shock detection input.
10
TH
I
Sets the time constant for the tracking gain.
11
TA
O
TA amp output.
12
TD
I
Composes the tracking phase compensation constant between the TD and VR pins.
13
TD
O
Sets the tracking phase compensation.
14
JPI
Sets the amplitude of the tracking jump signal (kick pulses).
15
TO
O
Tracking control signal output.
16
FD
O
Focusing control signal output.
17
FD
I
Composes the focusing phase compensation constant between the FD and FA pins.
18
FA
O
Composes the focusing phase compensation constant between the FD- and FA- pins.
19
FA
I
Composes the focusing phase compensation constant between the FA and FE pins.
20
FE
O
FE signal output.
21
FE
I
For the connection of a resistor whichs sets the gain of the FE signal between this pin
and the TE pin.
22
A-GND
Ground of analog signals.
23
NC
Not connected.
24
SPO
Single-ended output of the signals input to the CV+ and CV- pins.
25
SPG
I
For the connection of a resistor which sets the gain in the spindle 12cm mode. (Not used)
26
SP
I
For the connection of the spindle phase compensation constant with the SPD pin.
27
SPD
O
Spindle control signal output.
28
SLEQ
I
For the connection of sled phase compensation constant.
29
SLD
O
Sled control signal output.
30
SL
I
Sled feed signal input from the microprocessor.
31
SL+
32
JP
I
Tracking signal input from the DSP.
33
JP+
34
TGL
I
Tracking gain control signal input from the DSP. Low gain when TGL is "H".
35
TOFF
I
Tracking off control signal input from the DSP. Off when TOFF is "H".
36
TES
O
Outputs the TES signal to the DSP.
37
HFL
O
The HFL (high frequency level) signal is used to judge whether the main beam is positioned
on the pit or on the mirror.
Description
Pin No.
Pin Name
I/O
IC, LA9241ML
All manuals and user guides at all-guides.com
Содержание XR-EM70
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