Chapter 6
167
MAINBOARD
MAIN BOARD DIS_NV11P HM55 DUAL CORE W/
CARD READER W/O CPU RAM
MB.PTY06.001
MAIN BOARD DIS_NV11P HM55 QUAD CORE W/
CARD READER W/O CPU RAM
MB.PU306.001
MAIN BOARD UMA HM55 W/CARD READER W/O
CPU RAM
MB.PTW06.001
MAIN BOARD DIS_ NV11M HM55 DUAL CORE W/
CARD READER W/O CPU RAM
MB.PTX06.001
MAIN BOARD DIS_NV11M HM55 QUAD CORE W/
CARD READER W/O CPU RAM
TBD
MEMORY
Memory ELPIDA SO-DIMM DDRIII 1066 1GB
EBJ10UE8BDS0-AE-F LF 128*8 0.065um
KN.1GB09.012
Memory SAMSUNG SO-DIMM DDRIII 1066 1GB
M471B2873EH1-CF8 LF 64*16 0.055um
KN.1GB0B.028
Memory HYNIX SO-DIMM DDRIII 1066 1GB
HMT112S6BFR6C-G7 N0 LF 64*16 0.055um
KN.1GB0G.025
Memory ELPIDA SO-DIMM DDRIII 1066 2GB
EBJ21UE8BDS0-AE-F LF 128*8 0.065um
KN.2GB09.006
Memory SAMSUNG SO-DIMM DDRIII 1066 2GB
M471B5673EH1-CF8 LF 128*8 0.055um
KN.2GB0B.012
Memory HYNIX SO-DIMM DDRIII 1066 2GB
HMT125S6BFR8C-G7 N0 LF 128*8 0.055um
KN.2GB0G.014
Memory ELPIDA SO-DIMM DDRIII 1333 1GB
EBJ10UE8BDS0-DJ-F LF 128*8 0.065um
KN.1GB09.015
Memory SAMSUNG SO-DIMM DDRIII 1333 1GB
M471B2873FHS-CH9 LF 128*8 46nm
KN.1GB0B.035
Memory ELPIDA SO-DIMM DDRIII 1333 4GB
EBJ41UF8BAS0-DJ-F LF 256*8 0.055um
KN.4GB09.001
Memory SAMSUNG SO-DIMM DDRIII 1333 2GB
M471B5673FH0-CH9 LF 128*8 46nm
KN.2GB0B.023
HEATSINK
THERMAL MODULE (DIS)
60.PU407.003
THERMAL MODULE (UMA)
60.PTW07.002
HEAT SINK
60.PTN07.008
SPEAKER
SPEAKER MODULE (WITH L/R)
23.PTN07.001
SPEAKER MODULE (WITH L/R)QMI
23.PTN07.002
MISCELLANEOUS
CATEGORY
PARTNAME
ACERPARTNO.
Содержание ASPIRE 5745
Страница 6: ...VI ...
Страница 10: ...X Table of Contents ...
Страница 48: ...38 Chapter 2 ...
Страница 56: ...46 Chapter 3 4 Lift the base door out and away ...
Страница 61: ...Chapter 3 51 5 Pull the WLAN module out and away ...
Страница 68: ...58 Chapter 3 8 Flip the keyboard over 9 Detach the keyboard FPC a Unlock the FPC b Pull the keyboard away a b ...
Страница 74: ...64 Chapter 3 4 Unlock and disconnect the switch board FFC ...
Страница 76: ...66 Chapter 3 4 Lift the power board away ...
Страница 81: ...Chapter 3 71 4 Lift away the I O board 5 Unlock and remove the I O board FFC from the mainboard ...
Страница 83: ...Chapter 3 73 5 Detach the Bluetooth module cable from the module ...
Страница 94: ...84 Chapter 3 4 Pry open the bottom corners and along the bottom edge 5 Lift the bezel off the module ...
Страница 98: ...88 Chapter 3 7 Disconnect the FPC cable ...
Страница 102: ...92 Chapter 3 8 Pry the antenna off the casing ...
Страница 105: ...Chapter 3 95 7 Lay the cables along the retention guides ...
Страница 106: ...96 Chapter 3 Replacing the Microphone 1 Lay the microphone cable in the retention guides 2 Adhere the microphone ...
Страница 112: ...102 Chapter 3 3 Press down on the bezel edge working simultaneously around the edges to the bottom ...
Страница 117: ...Chapter 3 107 2 Using a flat bladed screw driver rotate the CPU locking screw 180 clockwise to secure the CPU in place ...
Страница 121: ...Chapter 3 111 3 Connect and lock the I O card FFC to the I O board 4 Connect and lock the I O card FFC to the mainboard ...
Страница 123: ...Chapter 3 113 4 Connect the Bluetooth module cable to the main board ...
Страница 126: ...116 Chapter 3 7 Lay the LVDS cable across the assembly as shown and press down firmly 8 Connect the LVDC cable ...
Страница 132: ...122 Chapter 3 7 Connect and lock the button board FFC ...
Страница 138: ...128 Chapter 3 4 Grasp the tab and slide the HDD firmly into the docking connector ...
Страница 141: ...Chapter 3 131 4 Push the ODD completely into the bay until flush with the lower cover ...
Страница 142: ...132 Chapter 3 Replacing the Base Door 1 Insert the base door edge flanges into the slots 2 Lower the base door ...
Страница 162: ...152 Chapter 4 ...
Страница 230: ...220 ...
Страница 233: ...223 Index ...