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Issue 5 - September 2006
Page 6 of 65
1
Glossary of Terms
1oo2
One out of two voting
2oo2
Two out of two voting
2oo3
Two out of three voting
3-2-1
Three to two to one processor degradation
3-2-0
Three to two to zero processor degradation
A,B or C
System channel reference
ac alternating
current
BSI British
Standards
Institute
CE
Indicates compliance with applicable European Community directives
CI
Common Interface (a daughter board fitted to I/O modules).
dc direct
current
EMC
Electro Magnetic Compatibility
EPROM
Erasable Programmable Read Only Memory
ESD Emergency
Shutdown
F&G Fire
and
Gas
FAT Factory
Acceptance
Test
FPGA
Field Programmable Gate Array
GTZ
Go To Zero
HR Hot
Repair
HW Hardware
id identity
I/O Input
and/or
Output
IEC International
Electrotechnical
Commission
ISO
International Standards Organisation
LED
Light Emitting Diode
LFD Latent
Fault
Detection
MBB Bus
Buffer
Interface
module
MDR
Mandatory Design Review
MPP Main
Processor
MTTR Mean
Time
To
Repair
PAC
AC Power Supply for a Triguard system
PID
Proportional, Integral and Derivative - process control signals
PLC
Programmable Logic Controller
PSU
Power Supply Unit
PVCS
Product Version Control Specification
QA Quality
Assurance
QM Quality
Management
RAM Random
Access
Memory
ROM
Read Only Memory
RS232C
Serial binary data exchange standard
RTTS
Real Time Task Supervisor (Main Processors operating system.)
SAT Site
Acceptance
Test
SIFT Software
Implemented
Fault
Tolerance
SS Standard
Specification
SW Software
System
channel
One third of a triplicated circuit
THR
Hot Repair Adapter Card
TMR Triple
Modular
Redundancy
TriBuild
Software application programming package for SC300E