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Zte MG2639, User Manual

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Zte MG2639 User Manual Download Page 43

 

User Manual 

 

This document is not allowed to 
transmit without ZTE Corporation

’s 

permission 

©ZTE CORPORATION All rights reserved 

34 

 

6.2.1

 

Module’s Baking Environment 

The operators must wear dust-free finger cots and anti-static wrist strap under the lead-free and 

good static-resistant environment.   

See the following environment requirements. 

 

 

During the process of transportation, storage and disposal, you must conform to the IPC/JEDE 

J-STD-033 standard. 

6.2.2

 

Baking Devices and Operation Procedure

 

Baking device: any oven where the temperature can rise up to 125°C or above. 
Precautions regarding baking: during the baking process, the modules should be put in the 

high-temperature resistant pallet flatly and slightly to avoid the collisions and frictions between the 
modules. During the baking process, do not overlay the modules directly because it might cause 
damage to the module’s chipset. 

6.2.3

 

Parameter Settings of Baking Devices

 

Baking temperature: 125

℃

±5

℃

 

Baking duration: 8 hours 

Summary of Contents for MG2639

Page 1: ...MG2639_V3 Module Hardware Design User Manual Version V1 2 ...

Page 2: ...the registered trademark of ZTE Corporation All other trademarks appeared in this manual are owned by the relevant companies Nothing contained in this manual should be construed as granting by implication estoppel or otherwise any license or right to use any trademarks displayed in this manual without the prior written permission of ZTE Corporation or third party obligee This product conforms to t...

Page 3: ... MG2639_V3 V1 0 Released for the first time 2013 9 6 MG2639_V3 V1 1 Add Refer to GPS design 4 6 2013 11 08 MG2639_V3 V1 2 1 the module s thickness has changed from 2 68mm to 3 0mm 2 delete GPS supports passive antenna only in Section 4 6 3 Add Section 4 7 Connection Method of GPS Active Antenna 2014 1 4 Writer Document version Date Written by Checked by Approved by 1 0 2012 8 23 Cai Zongfei 1 1 20...

Page 4: ...th the following all around technical support 1 Provide complete technical documentation 2 Provide the development board used for R D test production after sales etc 3 Provide evaluations and technical diagnosis for principle diagram PCB test scenarios 4 Provide test environment ZTE Corporation provides customers with onsite supports and also you could get supports through telephone website instan...

Page 5: ...ple diagram module s PINs hardware interface and module s structure and instructs the users to perform hardware design of modules and quickly and conveniently design different kinds of wireless terminals on the basis of this module Target Readers This document mainly applies to the following engineers System designing engineers Mechanical engineers Hardware engineers Software engineers Test engine...

Page 6: ... 2 ANTENNA INTERFACE 8 2 3 ANTENNA INTERFACE S RF PERFORMANCE 11 3 MODULE S ELECTRICAL CHARACTERISTICS 12 3 1 DESCRIPTIONS OF LEVELS OF INTERFACE SIGNALS 12 3 1 1 RESET 12 3 1 2 UART 12 3 1 3 I2C 12 3 1 4 SPI 13 3 1 5 PCM 13 3 1 6 USB 14 3 1 7 ADC 14 3 1 8 PWM 14 3 1 9 LCD 14 3 1 10GPS GLONASS BEIDOU 15 3 1 11CHARGING 16 3 1 12SIM CARD INTERFACE 16 3 1 13AUDIO INTERFACE 16 3 1 14NETWORK SIGNAL IND...

Page 7: ...S 30 6 1 1 PROCESS ROUTING SELECTION 30 6 1 2 SOLDER PASTE SELECTION 30 6 1 3 DESIGN OF INTERFACE BOARD S PAD THICKNESSES OF GREEN OIL AND WHITE OIL AT THE MODULE ON THE INTERFACE BOARD 30 6 1 4 DESIGN OF STEEL MESH APERTURE AT THE MODULE BOARD S PAD ON THE INTERFACE BOARD 31 6 1 5 MODULE BOARD S MOUNTING 31 6 1 6 FURNACE TEMPERATURE CURVE 32 6 1 7 REFLOW METHOD 33 6 1 8 MAINTENANCE OF RETURNED DE...

Page 8: ...5 Figure 4 8 Audio interface circuit reference design principle diagram 26 Figure 4 9 Charging interface circuit reference design principle diagram 27 Figure 5 1 Furnace temperature curve 错误 未定义书签 Figure 6 1 MG2639_V3 appearance diagram 35 Figure 6 2 Module s assembly diagram 36 Figure 6 3 Relevant package dimensions from TOP view 37 Figure 6 4 Relevant package dimensions from BOTTOM view 38 Table...

Page 9: ...meters 15 Table 3 11 Charging interface signal definitions 16 Table 3 12 SIM card interface signal definitions 16 Table 3 13 Audio interface signal definitions 17 Table 3 14 MG2639_V3 power consumption 17 Table 3 15 MG2639_V3 module s temperature characteristics 18 Table 3 16 ESD characteristics 18 Table 4 1 Voltage characteristics 20 Table 4 3 UART1 interface definitions 23 Table 4 4 UART2 interf...

Page 10: ...communication it provides a highly free and convenient solution to users and truly realizes the dream of mobile office This chapter mainly provides a general description of the module including basic functions and logic block diagram 1 1 Introduction of module s functions See the functions of MG2639_V3 module in table 1 1 Table 1 1 Module s functions Parameters MG2639_V3 General Features Frequency...

Page 11: ... socket level 1 8V 3 0V Data service GPRS Class 10 Mobile Station Class B Max Downlink 85 6kbps Max Uplink 42 8kbps Protocol Internal TCP IP UDP protocol stack Embedded FTP SMS Support TEXT PDU Mode Point to point MO MT SMS Cell Broadcast Voice call Audio encoder HR FR EFR AMR Echo Cancellation Volume Control DTMF AT Command Set GSM 07 05 GSM 07 07 ZTE Proprietary AT Commands 1 2 Module s applicat...

Page 12: ...a Reference Point ASIC Application Specific Integrated Circuit B BER Bit Error Rate BTS Base Transceiver Station C CDMA Code Division Multiple Access CDG CDMA Development Group CS Coding Scheme CSD Circuit Switched Data CPU Central Processing Unit D DAI Digital Audio interface DAC Digital to Analog Converter DCE Data Communication Equipment DSP Digital Signal Processor DTE Data Terminal Equipment ...

Page 13: ...ization ITU International Telecommunications Union L LCD Liquid Crystal Display LED Light Emitting Diode M MCU Machine Control Unit MMI Man Machine Interface MS Mobile Station MTBF Mean Time Before Failure P PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication System PDU Protocol Data Unit PLL Phase Locked Loop PPP Point to point protocol R RAM Random Access Memory RF Radio...

Page 14: ... to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 5 UIM User Identifier Management USB Universal Serial Bus USIM Universal Subscriber Identity Module V VSWR Voltage Standing Wave Ratio Z ZTE ZTE Corporation ...

Page 15: ...nd 4 RING UART1 Output GPIO9 Ringer signal indication The voltage varies upon an incoming call or receipt of text message 2 8V IO 5 GND Ground Ground 6 VBAT Power Input Work voltage 3 4 4 2V 7 RSSI_LED LED Output GPIO58 Network signal indication Need add dynatron to drive The LED is ON at high level Power on state the LED is off Network searching state the LED blinks at 3Hz Idle state the LED blin...

Page 16: ...ng control Output Charging dynatron control Need externally connect charging circuit 28 ADCIN Analogue signal input Input ADC voltage detection 0 2 8V 29 URXD1 SPIM OSI UART1 SPI Input GPIO20 Receiving data for serial port UART1 can be used as SPI interface when not used 2 8V IO 30 UTXD1 SPIMI SO UART1 SPI Output GPIO21 Port sending UART1 can be used as SPI interface when not used 2 8V IO 31 SYSRS...

Page 17: ...O39 Serial LCD data cable input 1 8V IO 52 LSA0DA0 Serial LCD Output GPIO36 Serial LCD data cable1 1 8V IO 53 SDA28 SPICS I2C SPI I O GPIO2 I2C data cable also used for SPI chip select 2 8V IO 54 SCL28 SPISC K I2C SPI Output GPIO1 I2C clock cable also used for SPI clock 2 8V IO 55 PWM EARDE T PWM output Output GPIO0 PWM output PWM can be used as earpiece insert detection when not used 2 8V IO 56 P...

Page 18: ...larized ports on dual polarized antenna two different frequency ports on dual frequency antenna or among four ports on dual polarized dual frequency antenna isolation degree should be more than 30dB MG2639_V3 module provides both GSM and GPS antenna interface and either interface provides both RF socket and stamp hole connection method therefore users can select reasonably according to the product...

Page 19: ...res or RF port Scenario 2 When using GSM GPS RF socket as the antenna feed disconnect PIN2 PIN16 from the main board and make sure there are some empty areas below or around PIN2 PIN16 Keep 2mm distance between the surface of PIN2 PIN16 and GND and drill holes below PIN2 PIN16 It s not suggested to use the compatible design of PIN2 PIN16 at the same time when using the RF connector Figure 2 2 Ante...

Page 20: ...a interface s RF performance in table 2 2 Table 2 2 Antenna interface s RF performance Antenna interface s RF performance Module s uplink MS BTS Module s downlink BTS MS Max Tx Power dBm Antenna interface s Rx sensitivity GSM850 824MHz 849MHz 869MHz 894MHz 33 2 107dBm EGSM900 880MHz 915MHz 925MHz 960MHz 33 2 107dBm DCS1800 1710MHz 1785MHz 1805MHz 1880MHz 30 2 106dBm PCS1900 1850MHz 1910MHz 1930MHz...

Page 21: ...he UART1 supports 8 wire serial BUS interface see signal definitions in table 4 3 while UART2 supports 2 wire serial interface only The module can communicate externally and input the AT commands through the UART interface The GPS UART is used for GPS information output Table 3 1 UART interface signal definitions Classification No Definitions I O Description Remarks UART1 29 URXD1 Output Receiving...

Page 22: ...3 SPI Interface signal definitions Classification No Definitions I O Description Remarks SPI 53 SPICS Output SPI chip select 2 8V IO 54 SPISCK Output SPI clock 2 8V IO 29 SPIMOSI Input SPI data input 2 8V IO 30 SPIMISO Output SPI data output 2 8V IO Note the software doesn t support this interface by default therefore it requires customization 3 1 5 PCM MG2639_V3 module adopts its 56 60 PINs as th...

Page 23: ...vide up to 98 1 KSPS sampling rate and 10BIT A D conversion function Table 3 6 ADC interface signal definitions Classification No Definitions I O Description Remarks ADC 28 ADCIN Input Analogue signal input 0 2 8V Note the software doesn t support this interface by default therefore it requires customization 3 1 8 PWM Table 3 7 PWM interface signal definitions Classification No Definitions I O Des...

Page 24: ... GPS function is completely independent from its wireless data communication The GPS cell provides independent power input and PIN to output the GPS information through the serial port Table 3 9 GPS GLONASS Beidou interface signal definitions Classification No Definitions I O Description Remarks GPS 16 GPS_ANT Input GPS antenna 18 V_GPS Input GPS power input 3 4 4 3V 19 GPS_URXD Input GPS port NME...

Page 25: ... doesn t support this interface by default therefore it requires customization 3 1 12SIM card interface MG2639_V3 module supports the SIM card interface conforming to ISO 7816 3 standard and it supports SIM cards with two different standards 1 8V and 3 0V Users should note that the SIM card s electrical interface should be defined exactly the same as the SIM card socket Table 3 12 SIM card interfa...

Page 26: ...inks at 3Hz Idle status the LED blinks at 1Hz Traffic status call data the LED blinks at 5Hz The output status of RSSI_LED PIN is defined according to the software protocol The RSSI_LED PIN is a general I O port with the output driving capability 4mA 3 2 Module s power consumption It describes the module s power consumption under each status Table 3 14 MG2639_V3 GPRS power consumption Status Frequ...

Page 27: ...Ta Limited temperature 40 85 Make sure not to compromise the RF performance apparently Ts Storage temperature 40 85 3 4 ESD characteristics See the ESD characteristics at room temperature Table 3 16 ESD characteristics Interface Testing items Testing requirements Performance Antenna interface Air discharge 8 kV Nothing unusual Contact discharge 6 kV Nothing unusual SIM card interface Air discharge...

Page 28: ...power supply since VD1 is TVS tube and select CJ2305 from Changjiang Electronics or DMP2305U 7 from DIODES since VT1 is MOS tube Refer to figure 4 2 for the design of power circuit Select MIC29302 and adjust the output voltage through the adjustment of R5 and R6 Please refer to MIC29302 s specification for detailed parameters design Please note that the components in the figure are just for your r...

Page 29: ... system because it might affect the RF performance 2 Select the power cables with at least 80mil traces during the layout and keep the integrality of ground line 3 Make sure the Max instantaneous output current is larger than 2A if the Max input current is very high Power on The module is under power off status after it s normally powered on To turn on the module provide a 2s 5s low level pulse to...

Page 30: ...ded to use this pin to pull up the chipset PIN as per the requirements of level matching Therefore it s not recommended to use this pin for other purposes Other advice In order to make sure the data is saved safely and guarantee the safety of module s data please don t cut off the power when the module is on 4 2 UART interface MG2639_V3 module provides an integrated full duplex UART1 interface sho...

Page 31: ...evel conversion Figure 4 3 shows the level conversion to 3 3V through the UART interface of MG2639_V3 The resistance and capacitance in figure 4 3 are just for reference and they need to be recalculated during the design The diode in Figure 4 4 is Schottky diode forward voltage drop is 0 3V If you select other diodes please select one with lower forward voltage drop to make sure RXD_2V8 is below t...

Page 32: ...ce definitions Classification No Definitions I O Descriptions Remarks UART 29 RXD1 Input Receiving data DTE transmits serial data 8 RTS1 Output Ready to send DTE informs DCE to send 30 TXD1 Output Transmitting data DTE receives serial data 39 DTR1 Input Data terminal ready DTE is ready 9 CTS1 Input Clear to send DCE has switched to Rx mode 4 RING Output Ringtone indication Inform DTE upon a remote...

Page 33: ...onnection relationship diagram See the definitions of UART2 interface in table 4 4 Table 4 4 UART2 interface definitions Classification No Definitions I O Descriptions Remarks UART 43 RXD2 Input Receiving data DTE transmits serial data 44 TXD2 Output Transmitting data DTE receives serial data 4 3 SIM card interface MG2639_V3 module supports 1 8V or 3 0V SIM card Refer to figure 4 7 for design ...

Page 34: ... writing 3 Since the ESD components are very close to the SIM card socket it s recommended to add TVS components on 4 CH SIM card signals meanwhile the signal wires need go through TVS component before entering the module s baseband processor during the layout to avoid damaging the module 4 The width of VSIM power wiring should be above 6mil at least recommended to use 8mil 5 The filter capacitanc...

Page 35: ...t voltage is generated Speaker The RECP RECN are both differential interfaces with 32 ohm impedance while the EAR_L is single ended interface with 32 ohm impedance GSM GPRS module audio interface is designed as below Design of the audio interface on the receiver Select the microphone with the sensitivity lower than 51 5dB since the max gain inside MIC0 can reach 51 5dB The level of MIC1_P0 is abou...

Page 36: ... to improve the audio quality 2 Connect TVS tube or pressure sensitive resistance on the audio path approaching the module s interface to prevent the ESD from damaging the module 3 Make sure the use environment and module are well grounded and there is no mutual influence 4 The power ripple supplied to the module is less than 50mV 4 5 Charging interface The PINs used for MG2639_V3 module s chargin...

Page 37: ...to RTC a button battery can also supply power to RTC Keep power supplied by RTC can effectively shorten first positioning time as V_GPS powers up after power down If you don t ask too much of first positioning time as V_GPS powers up you can directly connect VRTC to V_GPS power supply 4 7 Connection Method of GPS Active Antenna In the figure below V_G_ANT works as the power supply of GPS antenna S...

Page 38: ...e grounding and avoid interference on the sensitivity 2 Copper clad and wiring are forbidden in the nearby areas of the RF stamp hole 3 For the convenience of testing and maintenance it is recommended to drill holes on the PCB to expose JTAG test points 4 The wiring between the SIM card socket and MCU should be as short as possible to prevent signals from being affected by long wiring which might ...

Page 39: ... lead free technology and meet the ROHS requirements we recommend that the lead free manufacturing process should be used upon the selection of process routing for module board and interface board 6 1 2 Solder Paste Selection The solder pastes with metal particle TYPE3 and TYPE4 can fulfill the welding requirements It is accordingly recommended to use the no clean solder paste If the solder paste ...

Page 40: ... the encapsulation type of components on the interface board The expected thickness of steel mesh at the module on the interface board is 0 15mm locally increased to 0 18MM at the module position or just 0 18mm In respect of the steel mesh aperture the inner side of the pad is cut by 0 3mm the two sides are respectively cut by 0 1mm and the outside is extended by 0 5mm 6 1 5 Module Board s Mountin...

Page 41: ...ent welding the pressure of placing the module board on the interface board is 2 5N according to our experiences Different modules have different numbers of pads therefore the pressure selected are different Customers can select proper pressure based on their own situations 6 1 6 Furnace Temperature Curve As for the furnace temperature curve of module we recommend that the peak temperature should ...

Page 42: ... is preferable for the interface board to reflow on the mesh belt at the first mounting and the second mounting If such failure is caused by any special reason the fixture should be also used to reflow in order to avoid the deformation of PCB during the reflow process 6 1 8 Maintenance of Returned Defects If any poor welding occurs to the module board and the interface board e g pseudo soldering o...

Page 43: ...disposal you must conform to the IPC JEDE J STD 033 standard 6 2 2 Baking Devices and Operation Procedure Baking device any oven where the temperature can rise up to 125 C or above Precautions regarding baking during the baking process the modules should be put in the high temperature resistant pallet flatly and slightly to avoid the collisions and frictions between the modules During the baking p...

Page 44: ... not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 35 7 Mechanical dimensions 7 1 Appearance diagram Figure 7 1 MG2639_V3 appearance diagram Dimensions L W H 30 0 25 0 3 0mm Weight 6g ...

Page 45: ...ment is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 36 7 2 Module s assembly diagram See the module s assembly diagram in figure 7 2 Figure 7 2 Module s assembly diagram ...

Page 46: ...lowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 37 7 3 Module s PCB package dimensions See the module s PCB package dimensions in figure 7 3 Figure 7 3 Relevant package dimensions from TOP view ...

Page 47: ...User Manual This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 38 Figure 7 4 Relevant package dimensions from BOTTOM view ...

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