User Manual
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The furnace temperature test board must be a physical board mounted on the interface board, and
there must be the testing wires at the module board.
6.1.7
Reflow Method
If the interface board used by customers is a double-sided board, it is recommended to mount
the module board at the second time. In addition, it is preferable for the interface board to reflow on
the mesh belt at the first mounting and the second mounting. If such failure is caused by any special
reason, the fixture should be also used to reflow in order to avoid the deformation of PCB during the
reflow process.
6.1.8
Maintenance of Returned Defects
If any poor welding occurs to the module board and the interface board, e.g., pseudo soldering of
the module board and the interface board, the welder can directly use the soldering iron to repair
welding according to the normal welding parameters of our company
6.2
Module’s Baking Guide
The module must be baked prior to second reflow.
