1-3
SERVICING PRECAUTIONS
CAUTION: Before servicing the VCR + DVD RECODER cov-
ered by this service data and its supplements and addends,
read and follow the SAFETY PRECAUTIONS. NOTE: if
unforeseen circumstances create conflict between the fol-
lowing servicing precautions and any of the safety precau-
tions in this publications, always follow the safety precau-
tions.
Remember Safety First:
General Servicing Precautions
1. Always unplug the VCR + DVD RECODER AC power cord
from the AC power source before:
(1) Removing or reinstalling any component, circuit board,
module, or any other assembly.
(2) Disconnecting or reconnecting any internal electrical
plug or other electrical connection.
(3) Connecting a test substitute in parallel with an elec-
trolytic capacitor.
Caution:
A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may result
in an explosion hazard.
2. Do not spray chemicals on or near this VCR + DVD
RECODER or any of its assemblies.
3. Unless specified otherwise in this service data, clean
electrical contacts by applying an appropriate contact
cleaning solution to the contacts with a pipe cleaner,
cotton-tipped swab, or comparable soft applicator.
Unless specified otherwise in this service data, lubrication
of contacts is not required.
4. Do not defeat any plug/socket B+ voltage interlocks with
whitch instruments covered by this service manual might
be equipped.
5. Do not apply AC power to this VCR + DVD RECODER
and / or any of its electrical assemblies unless all solid-
state device heat sinks are correctly installed.
6. Always connect the test instrument ground lead to an
appropriate ground before connecting the test instrument
positive lead. Always remove the test instrument ground
lead last.
Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet and turn
the power on. Connect an insulation resistance meter (500V)
to the blades of the attachment plug. The insulation resis-
tance between each blade of the attachment plug and acces-
sible conductive parts (Note 1) should be more than 1M-
ohm.
Note 1:
Accessible Conductive Parts include Metal panels,
Input terminals, Earphone jacks,etc.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field
effect transistors and semiconductor chip components.
The following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor compo-
nent or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known
earth ground. Alternatively, obtain and wear a commer-
cially available discharging wrist strap device, which
should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such
as aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static solder removal device. Some
solder removal devices not classified as “anti-static” can
generate electrical charges sufficient to damage ES
devices.
5. Do not use freon-propelled chemicals. These can
generate an electrical charge sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protec-
tive package until immediately before you are ready to
install it. (Most replacement ES devices are packaged with
leads electrically shorted together by conductive foam,
aluminum foil,or comparable conductive material).
7. Immediately before removing the protective material from
the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the
device will be installed.
Caution: Be sure no power is applied to the chassis or
circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Normally harmless motion such
as the brushing together of your clothes fabric or the lifting
of your foot from a carpeted floor can generate static elec-
tricity sufficient to damage an ES device.)
Summary of Contents for XBR413
Page 9: ...OVERALL WIRING DIAGRAM 3 2 ...
Page 35: ...3 36 3 37 EE MODE VIDEO TU MODE AUDIO 2 TU IF CIRCUIT DIAGRAM ...
Page 37: ...3 40 3 41 4 JACK CIRCUIT DIAGRAM ...
Page 43: ...3 52 3 53 PRINTED CIRCUIT DIAGRAMS 1 VCR P C BOARD ...
Page 44: ...3 54 3 55 3 TIMER P C BOARD LOCATION GUIDE 2 POWER P C BOARD ...
Page 45: ...3 56 3 57 4 KEY P C BOARD 5 JACK P C BOARD ...
Page 46: ......
Page 59: ...3 70 3 71 CIRCUIT DIAGRAMS 1 E5_BGA POWER UART2 CIRCUIT DIAGRAM ...
Page 60: ...3 72 3 73 2 DDR_SDRAM FLASH CIRCUIT DIAGRAM ...
Page 61: ...3 74 3 75 3 RST CONTROL STATUS_REG ATAPI HOST_CPLD LATCH CIRCUIT DIAGRAM ...
Page 62: ...3 76 3 77 4 1394 ETHERNET_CONNECTOR CIRCUIT DIAGRAM ...
Page 63: ...3 78 3 79 5 VIDEO_IN OUT CIRCUIT DIAGRAM ...
Page 64: ...3 80 3 81 6 AUDIO IN OUT NON STD_VIDEO CIRCUIT DIAGRAM ...
Page 65: ...3 82 3 83 7 AUDIO DAC VIDEO_Y MIXER CIRCUIT DIAGRAM ...
Page 66: ...8 FRONT A V 1934 JACK CIRCUIT DIAGRAM 3 84 3 85 ...
Page 71: ...3 94 3 95 PRINTED CIRCUIT DIAGRAMS 1 MAIN P C BOARD TOP VIEW ...
Page 72: ...3 96 3 97 2 MAIN P C BOARD BOTTOM VIEW ...
Page 102: ...3 127 4 IC302 uPD76f0047 MICOM Pin Assignment ...
Page 124: ......
Page 126: ...3 151 3 152 2 DSP CIRCUIT DIAGRAM No Power No operation DSP IC RESET IC SDRAM R259 0Ω ...
Page 128: ...3 155 3 156 PRINTED CIRCUIT DIAGRAMS 1 MAIN P C BOARD LOCATION GUIDE ...
Page 130: ......
Page 153: ...4 22 GEAR F R GEAR AY P2 P3 F R Lever Tension Base Boss CAM ...
Page 162: ...MEMO ...