MIA-M10Q - Integration manual
Figure 32: Example of a 2 layer design for the MIA-M10Q
The length and geometry in the RF signal line must be carefully analyzed. The impedance of the RF
signal line must be 50 Ω. Select accordingly the stack-up, copper, and dielectric properties of the
PCB to fulfill this condition. The RF signal line should be as short as possible and the ground plane
around should be filled with GND vias.
shows an example of a PCB design where the second layer has been left out as a ground
plane, and the routed lines have been brought to another layer.
Figure 33: Example of a +2 layer design for the MIA-M10Q
Care must also be exercised with placing the receiver in proximity to circuitry that can emit heat.
Temperature-sensitive components inside the module, like TCXOs and crystals, are sensitive to
sudden changes in ambient temperature which can adversely impact satellite signal tracking.
Sources can include co-located power devices, cooling fans or thermal conduction via the PCB.
The GND planes can conduct heat to other elements, but they can act as heat dissipators as well.
Increasing the number of GND vias helps to decrease sudden temperature changes.
High temperature drift and air vents can affect the GNSS performance. For best
performance, avoid high temperature drift and air vents near the module.
3.5.1 Package footprint, copper and solder mask
MIA form factor is 4.5 x 4.5 x 1 mm. All pads have 0.27 mm diameter.
describes the
footprint and the solder mask. A solder mask with an opening diameter of 0.37 mm is recommended.
The paste mask shall be same as the cooper pads.
UBX-21028173 - R01
3 Hardware integration
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