5
1. This unit is great for desoldering and soldering applications on small
components ,such as SOIC, CHIP, QFP, PLCC, BGA, SMD packaging,
and more. This unit is especially suited for desoldering operations on
sockets in in-line packaging.
2. The unit's applications include heat shrinking, drying, paint removal,
glue removal, defrosting, pre-heating, glue soldering, and more.
Model Number
USS-SS00002
Control Unit Dimensions
L150*W136*H100mm
±
5mm
Hot Air Rework Station
Air flow Type
Brushless Fan with Smooth Air Delivery
Air Volume
≤
120L/Min
Temperature Range
100
℃
〜
480
℃
/212
℉
〜
896
℉
Display
LCD
Soldering Station
Temperature Range
200
℃
〜
480
℃
/392
℉
〜
896
℉
Display
LCD
Tip to Ground Resistance
<2Ohms
SPECIFICATION & APPLICATIONS