User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH
Page 4
2.
BRIEF DESCRIPTION
This User's Manual describes the hardware of the TQMa6x revision 04xx, and refers to some software settings.
A certain derivative of the TQMa6x does not necessarily provide all features described in this User's Manual.
Functional differences between Dual/Quad and DualPlus/QuadPlus are referred to in the relevant passages.
This User's Manual does also not replace the NXP i.MX6 Reference Manuals (4), (5), and (6).
The TQMa6x is a universal Minimodule based on the NXP ARM CPU MCIMX6 (i.MX6).
The Cortex™ A9 core of this i.MX6 is typically clocked with 800 MHz.
The TQMa6x extends the TQC product range and offers an outstanding computing performance.
A suitable i.MX6 derivative (Single, Dual, Quad core) can be chosen for each requirement.
2.1
Key functions and characteristics
The TQMa6x provides the following key functions and characteristics:
•
NXP i.MX6 (Solo, DualLite, Dual, Quad, DualPlus, QuadPlus)
•
Up to 2 Gbyte DDR3L SDRAM, 64 bit interface (except “Solo”: 32 bit interface)
•
Up to 8 Gbyte eMMC NAND flash
•
Up to 128 Mbyte SPI NOR flash
•
64 kbit EEPROM
•
Temperature sensor
•
NXP PMIC (Power Management Integrated Circuit)
•
Extended temperature range
•
Single 5 V power supply
•
Hardware is backward compatible with TQMa6x revision 02xx
All essential i.MX6 pins are routed to the connectors.
There are therefore no restrictions for customers using the TQMa6x with respect to an integrated customised design.
3.
ELECTRONICS
The information provided in this User's Manual is only valid in connection with the tailored boot loader,
which is preinstalled on the TQMa6x, and the
BSP provided by TQ-Systems GmbH
3.1
System overview
3.1.1
System architecture / block diagram
i.MX6x
DDR3L SDRAM
Connector 160 pins
eMMC
EEPROM
Temperature
sensor
PMIC
PF0100
DC/DC 4V2
Connector 160 pins
5V
SPI NOR flash
Connector
40 pins
Supervisor
Illustration 1:
Block diagram TQMa6x
1:
It is not possible to boot from an SPI NOR flash bigger than 16 Mbyte.
