User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH
Page 44
4.4
Adaptation to the environment
The TQMa6x has overall dimensions (length × width × height) of 70 × 46 mm × 7.1 mm³.
The TQMa6x has a maximum height above the carrier board of approximately 8.86 mm.
The TQMa6x weighs approximately 21 grams.
4.5
Protection against external effects
As an embedded module, the TQMa6x is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
4.6
Thermal management
To cool the TQMa6x, a theoretical maximum of approximately 17 W have to be dissipated, see also chapter 3.2.7.3.
The cooling solution must be able to dissipate this power peak; it will never occur permanently in normal operation.
The power dissipation originates primarily in the i.MX6, the DDR3L SDRAM and the PMIC. The power dissipation also depends on
the software used and can vary according to the application. See NXP Application Notes (11), (12), (13), for further information.
When designing a cooling solution, a maximum contact force of 50 N may be applied to the i.MX6, see also NXP Application Note
AN4871 (14).
Attention: Malfunction or destruction
The i.MX6 belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the i.MX6 must be taken into consideration when
connecting the heat sink, see AN4871 (14). The i.MX6 is not necessarily the highest component.
Inadequate cooling connections can lead to overheating of the TQMa6x and thus malfunction,
deterioration or destruction.
4.7
Structural requirements
The TQMa6x is held in the mating connectors by the retention force of the pins (320 or 360). For high requirements with respect
to vibration and shock firmness, an additional plastic retainer has to be provided in the final product to hold the TQMa6x in its
position. Since no heavy and big components are used, no further requirements are given.
4.8
Notes of treatment
To avoid damage caused by mechanical stress, the TQMa6x may only be extracted from the carrier board by using the extraction
tool MOZIA6X that can also be obtained separately.
Attention: Note with respect to the component placement of the carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMa6x
for the extraction tool MOZIA6X.
