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SLOU186F
–
AUGUST 2006
–
REVISED AUGUST 2010
Table 3-1. Terminal Functions (continued)
TERMINAL
TYPE
(1)
DESCRIPTION
NAME
NO.
I/O pin for parallel communication
I/O_5
22
BID
Strobe out clock for serial communication
Data clock output in direct mode
I/O pin for parallel communication
I/O_6
23
BID
MISO for serial communication (SPI)
Serial bit data output in direct mode 1 or sub-carrier signal in direct mode 0
I/O pin for parallel communication.
I/O_7
24
BID
MOSI for serial communication (SPI)
Pulse enable and selection of power down mode. If EN2 is connected to VIN, then VDD_X is
EN2
25
INP
active during power down to support the MCU. Pin can also be used for pulse wake-up from
power-down mode.
DATA_CLK
26
INP
Clock input for MCU communication (parallel and serial)
Clock for MCU (3.39 / 6.78 / 13.56 MHz) at EN = 1 and EN2 = don't care
SYS_CLK
27
OUT
If EN = 0 and EN2 = 1, then system clock is set to 60 kHz
EN
28
INP
Chip enable input (If EN = 0, then chip is in power-down mode).
VSS_D
29
SUP
Negative supply for internal digital circuits; normally connected to circuit ground
OSC_OUT
30
OUT
Crystal oscillator output
OSC_IN
31
INP
Crystal oscillator input
VDD_X
32
OUT
Internally regulated supply (2.7 V
–
3.4 V) for external circuitry (MCU)
Thermal Pad
Connected to circuit ground
3.2
PACKAGING/ORDERING INFORMATION
(1)
PACKAGED DEVICES
PACKAGE TYPE
(2)
TRANSPORT MEDIA
QUANTITY
TRF7960RHBT
Tape and reel
250
RHB-32
TRF7960RHBR
Tape and reel
3000
TRF7961RHBT
Tape and reel
250
RHB-32
TRF7961RHBR
Tape and reel
3000
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at
www.ti.com
.
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package
.
6
Physical Characteristics
Copyright
©
2006
–
2010, Texas Instruments Incorporated
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