MSP430xG461x
MIXED SIGNAL MICROCONTROLLER
SLAS508I − APRIL 2006 − REVISED MARCH 2011
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
{
PACKAGED DEVICES
}
T
A
PLASTIC 100-PIN TQFP
(PZ)
PLASTIC 113-BALL BGA
(ZQW)
MSP430FG4616IPZ
MSP430FG4616IZQW
MSP430FG4617IPZ
MSP430FG4617IZQW
MSP430FG4618IPZ
MSP430FG4618IZQW
40
°
C to 85
°
C
MSP430FG4619IPZ
MSP430FG4619IZQW
−40
°
C to 85
°
C
MSP430CG4616IPZ
MSP430CG4616IZQW
MSP430CG4617IPZ
MSP430CG4617IZQW
MSP430CG4618IPZ
MSP430CG4618IZQW
MSP430CG4619IPZ
MSP430CG4619IZQW
†
For the most current package and ordering information, see the Package Option
Addendum at the end of this document, or see the TI
web site at www.ti.com.
‡
Package drawings, thermal data, and symbolization are available at
www.ti.com/packaging.
DEVELOPMENT TOOL SUPPORT
All MSP430 microcontrollers include an Embedded Emulation Module (EEM) allowing advanced debugging
and programming through easy-to-use development tools. Recommended hardware options include:
D
Debugging and Programming Interface
−
MSP-FET430UIF (USB)
−
MSP-FET430PIF (Parallel Port)
D
Debugging and Programming Interface with Target Board
−
MSP-FET430U100 (for PZ package)
D
Standalone Target Board
−
MSP-TS430PZ100 (for PZ package)
D
Production Programmer
−
MSP-GANG430
Summary of Contents for MSP430CG4616IPZ
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