Table B-21. MSP-TS430RGZ48B Bill of Materials
Position
Ref Des
No. per
Board
Description
Digi-Key Part No.
Comment
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7, C12
3
10uF, 6.3V, SMD0805
4
C5, C11,
C13, C14
4
100nF, SMD0805
311-1245-2-ND
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
478-1403-2-ND
7
D1
1
green LED, SMD0805
P516TR-ND
8
J1, J2, J3,
J4
0
12-pin header, TH
SAM1029-12-ND (Header)
SAM1213-12-ND
(Receptacle)
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
9
J5
1
3-pin header, male, TH
10
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
11
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
12
9
Jumper
15-38-1024-ND
See Pos. 10and Pos. 11
13
JTAG
1
14-pin connector, male,
TH
HRP14H-ND
14
BOOTST
0
10-pin connector, male,
TH
"DNP Keep vias free of solder"
15
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of solder
16
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
17
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
18
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
19
R1, R2, R4,
R6, R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
DNP: R6, R8, R9, R10, R11,R12
20
R5
1
47k Ω, SMD0805
541-47000ATR-ND
21
U1
1
Socket:
QFN11T048-008_A101121
_RGZ48
Manuf.: Yamaichi
22
PCB
1
81 x 76 mm
2 layers
23
Adhesive
plastic feet
4
Approximately 6mm width,
2mm height
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom side
24
MSP430
2
MSP430F5342IRGZ
DNP: enclosed with kit, supplied by TI
Hardware
94
MSP430™ Hardware Tools
SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
Copyright © 2020 Texas Instruments Incorporated