Table B-37. MSP-TS430PZ100B Bill of Materials
Position
Ref Des
No. per
Board
Description
Digi-Key Part No.
Comment
1
C1, C2
0
12pF, SMD0805
DNP
2
C4, C5, C6 ,
C7, C8, C9
6
100nF, SMD0805
311-1245-2-ND
3
C10, C26
2
470 nF, SMD0805
478-1403-2-ND
4
C11, C12
1
10 uF / 6.3 V SMD0805
C12 DNP
5
C13, C14,
C16, C18,
C19, C29
6
4.7 uF SMD0805
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3,
J4
0
25-pin header, TH
SAM1029-25-ND (Header)
SAM1213-25-ND
(Receptacle)
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
8
J5
1
3-pin header, male, TH
9
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
10
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
11
JP11, JP12,
JP13
3
4-pin header, male, TH
place jumper on header 1-2
12
13
Jumper
15-38-1024-ND
See Pos. 9 and Pos. 10 and Pos. 11
15
JTAG
1
14-pin connector, male,
TH
HRP14H-ND
16
BOOTST
0
10-pin connector, male,
TH
"DNP Keep vias free of solder"
17
Q1
0
Crystal
DNP: Q1 Keep vias free of solder
21
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
22
R1, R2, R4,
R6, R8,
R10, R11
2
0 Ohm, SMD0805
541-000ATR-ND
DNP: R4, R6, R8, R10, R11
23
R5
1
47k Ω, SMD0805
541-47000ATR-ND
24
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
25
PCB
1
90 x 82 mm
2 layers
26
Adhesive
plastic feet
4
Approximately 6mm width,
2mm height
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom side
27
MSP430
2
MSP430F6733IPZ
DNP: enclosed with kit, supplied by TI
Hardware
148
MSP430™ Hardware Tools
SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
Copyright © 2020 Texas Instruments Incorporated